Method for processing micro slot array on borosilicate glass surface
A borosilicate glass and surface processing technology, applied in the field of borosilicate glass surface processing micro-groove array, can solve the problems of practical difficulty, high cost, time-consuming and labor-intensive, etc., achieve low cost, improve the ability of erosion, reduce undercutting amount of effect
Inactive Publication Date: 2007-07-18
SHANGHAI JIAOTONG UNIV
View PDF2 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Although this method can process deep grooves on the glass and avoid defects such as pinholes on the glass surface, the above method is costly and time-consuming
Because the glass microgroove can only be further processed after opening a window on the silicon mask, and this process takes eight hours. After the processing is completed, it takes another eight hours to remove the silicon mask. The treatment of the membrane takes about sixteen to twenty hours, which takes too much time
Moreover, the single crystal silicon wafer used as a mask also greatly increases the cost of the above method, and there are still great difficulties in practical application.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreExamples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0024] 1. Sputter a chromium / copper seed layer on the surface of a borosilicate glass sheet with a diameter of 76 mm and a thickness of 500 microns after cleaning. The sputtering process conditions are: background vacuum 4×10 -4 Pa, the working gas is high-purity argon, and the working pressure is 5×10 -1 Pa, power 500 watts. The thickness of the chromium layer grown by sputtering is 10 nm, and the thickness of the copper layer is 80 nm.
[0025] 2. A layer of photoresist is spin-coated on the borosilicate glass sheet on which the metal seed layer has been sputtered, with a thickness of 5 microns. After photolithography, a mask window for processing the glass deep groove array is formed.
[0026] 3. Put the borosilicate glass sheet with the mask window into the etching solution to remove the seed layer in the window. Wherein, the chromium corrosion solution is 1000 milliliters of deionized water plus 42 milliliters of 70% perchloric acid plus 165 grams of cerium ammonium ni...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention provides a method for processing micro slot array on borosilicate glass surface which comprises sputtering Chromium copper seed layer onto the surface of cleaned boron-silicon glass sheets, forming mask window of processed glass deep groove array through photo-etching, placing the boron-silicon glass sheets into Chromium copper seed layer in the etching solution removing window, striping the analytical pure acetone through ultrasound, employing a plating method for electroplating copper masks, then plating gold masks onto the copper masks, etching continuously so as to obtain micro-trench array with smooth bottoms on the surface of the boron-silicon glass.
Description
technical field [0001] The invention relates to a preparation method in the technical field of micro-electromechanical manufacturing, in particular to a method for processing microgroove arrays on the surface of borosilicate glass. Background technique [0002] At present, research on microfluidic devices is in the ascendant, and microchannel structures prepared on substrate materials such as silicon wafers and glass are widely used in fields such as biochips and microchemical reaction chambers. Especially in the field of chip cooling, flow heat transfer in microchannels is an important topic in the current heat transfer field. Studies have shown that microchannel heat sinks with micron-sized grooves or pipe structures have extremely strong cooling capabilities, and their thermal resistance is 1 / 50 to 1 / 200 of that of passive heat sinks. It can play a major role in future chip packaging and device cooling. Among them, the manufacturing process of the water guide plate is t...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & AuthorityPatents(China)
IPC IPC(8): C03C17/06C03C15/00C25D3/38C25D3/48
CPCC03C15/00
Inventor戴旭涵赵小林丁桂甫蔡炳初
OwnerSHANGHAI JIAOTONG UNIV