Circuit board and its manufacturing method

A manufacturing method and circuit board technology, applied in printed circuit manufacturing, circuit substrate materials, printed circuits, etc., can solve the problems of insufficient stability of electrical properties of resin substrates, short circuit of migration circuits, and reduction of electrical insulation of substrates, etc.

Inactive Publication Date: 2003-07-16
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When this method is used in the method of printing a circuit by electrolytic or electroless plating, or when the plated layer is formed on the unnecessary part of the surface peeled off by burrs or the like, the stability of the electrical properties of the resin substrate may not be sufficient. , due to the type and compounding amount of the electroless plating catalyst reduce the electrical insulation of the substrate, and when the circuit board is used under high temperature and high humidity, due to the migration circuit is prone to short circuit, there are certain problems in obtaining a predetermined quality circuit board
On the other hand, although the present applicant proposed a method having the following characteristics in Japanese Patent Application Laid-Open No. 10-308562, that is, scanning and irradiating laser light on at least a part of the surface of the resin molded body, forming a substantially constant shape in the laser scanning direction. The metal film is formed by electroplating the rough surface composed of many concave parts at pitches, but there is a problem in workability, such as making a thick plating layer and prolonging the processing time.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Epoxy resin, phenolic resin, metal powder (copper powder), filler and other additives were mixed in the following ratios, and heated and kneaded at 100° C. with a kneading roll to obtain a resin molded body composition.

[0055] Ortho cresol novolak type epoxy resin: 100 parts by weight

[0056] (trade name: EOCN-1020, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 199 g / equivalent)

[0057] Phenolic novolac resin: 45 parts by weight

[0058] (Trade name: H-1, manufactured by Meiwa Kasei Co., Ltd., OH equivalent: 107 g / eq.)

[0059] Brominated epoxy resin: 27 parts by weight

[0060] (trade name: BREN-S, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 285 g / equivalent)

[0061] Spherical fused silica: 600 parts by weight

[0062] (Trade name: FB-74, manufactured by Denki Kagaku Co., Ltd., average particle diameter: 25 μm)

[0063] Copper powder: 100 parts by weight

[0064] (The maximum particle size is 10 microns, the average particle size is...

Embodiment 2

[0081] Epoxy resin, phenolic resin, metal powder (copper powder), filler and other additives were mixed in the following ratios, and heated and kneaded at 100° C. with a kneading roll to obtain a resin molded body composition.

[0082] Ortho cresol novolak type epoxy resin: 100 parts by weight

[0083] (trade name: EOCN-1020, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 199 g / equivalent)

[0084] Phenolic novolak resin: 45 parts by weight

[0085] (Trade name: H-1, manufactured by Meiwa Kasei Co., Ltd., OH equivalent: 107 g / eq.)

[0086] Brominated epoxy resin: 27 parts by weight

[0087] (trade name: BREN-S, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 285 g / equivalent)

[0088] Spherical fused silica: 720 parts by weight

[0089] (Trade name: FB-74, manufactured by Denki Kagaku Co., Ltd., average particle diameter: 30 μm)

[0090] Copper powder: 105 parts by weight

[0091] (The maximum particle size is 10 microns, the average particle size is...

Embodiment 3

[0111] Epoxy resin, phenolic resin, metal powder (copper powder), filler and other additives were mixed in the following ratios, and heated and kneaded at 100° C. with a kneading roll to obtain a resin molded body composition.

[0112] Ortho cresol novolak type epoxy resin: 100 parts by weight

[0113] (trade name: EOCN-1020, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 199 g / equivalent)

[0114] Phenolic novolak resin: 45 parts by weight

[0115] (Trade name: H-1, manufactured by Meiwa Kasei Co., Ltd., OH equivalent: 107 g / equivalent) Bromine-containing epoxy resin: 27 parts by weight

[0116] (trade name: BREN-S, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 285 g / equivalent)

[0117] Spherical fused silica: 720 parts by weight

[0118] (Trade name: FB-74, manufactured by Denki Kagaku Co., Ltd., average particle diameter: 30 μm)

[0119] Copper powder: 105 parts by weight

[0120] (The maximum particle size is 10 microns, the average particle si...

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Abstract

A circuit board comprising a resin molded article which includes a metal powder coated by an insulation film and a metal conductor which is formed by metal deposition over a circuit pattern drawn by laser beam irradiation on the surface of the resin molded article through electroless plating, and the method of producing the same.

Description

technical field [0001] The present invention relates to a circuit board obtained by printing a circuit on a substrate molded using a resin composition capable of forming highly adhesive metal wiring by electroplating on the surface of a resin molded body, and a method for manufacturing the same. Background technique [0002] Previously, resin-encapsulated circuits, named MIDs, were widely used. This kind of MID is to form a conductor circuit on the surface of a resin-molded 2-dimensional or 3-dimensional part. The resin used for the resin molded body can generally use polysulfone (PS), polyethersulfone (PES), polyetherimide (PEI), liquid crystal polymer (LCP) and thermoplastic resins such as engineering plastics. [0003] The demand for price reduction of packaged semiconductor components such as IC, CCD, and LD is rapidly increasing year by year, the surface mounting of resin-packaged 3-dimensional circuits, the miniaturization of micro circuits, high temperature stability...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/18
CPCH05K1/0373H05K3/185Y10S428/901H05K2201/09118H05K2203/0769H05K2201/0215H05K2203/107Y10T428/12014Y10T428/24917Y10T428/2991Y10T428/31678H05K3/08
Inventor 浦川俊也铃木庸平稻田邦博河野恭幸
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