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Semiconductor component basement and manufacture thereof, semiconductor potted element

A technology for semiconductors and packages, applied in the field of semiconductor device substrates

Inactive Publication Date: 2003-09-03
SOCIONEXT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, filling a deep via hole with metal without creating air gaps or voids is difficult and requires a long process time to fill the metal by electroplating

Method used

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  • Semiconductor component basement and manufacture thereof, semiconductor potted element
  • Semiconductor component basement and manufacture thereof, semiconductor potted element
  • Semiconductor component basement and manufacture thereof, semiconductor potted element

Examples

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Embodiment Construction

[0042] now refer to figure 1 An interposer is described, which is the semiconductor device substrate according to the first embodiment of the present invention. figure 1 is an enlarged sectional view of the inserter 1 according to the first embodiment of the present invention.

[0043] figure 1 The interposer 1 shown in FIG. 2 includes a silicon substrate 2, a multilayer wiring layer 4 formed on the top surface of the silicon substrate 2, and a plurality of mounting terminals 6 protruding from the lower surface of the silicon substrate 2. A semiconductor element is mounted on the upper half of the wiring layer 4 of the interposer 1, thereby forming a semiconductor package. The semiconductor package is flip-chip mounted on a circuit board through mounting terminals 6 protruding from the lower surface of the silicon substrate 2 .

[0044] The mounting terminal 6 is formed by a conductive layer, and its shape is as figure 2 The pyramidal shape shown in . A tip portion of th...

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PUM

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Abstract

A semiconductor device substrate has fine terminals with a small pitch and is able to be easily produced at a low cost without using a special process. A mounting terminal has a pyramidal shape and extending between a front surface and a back surface of a silicon substrate. An end of the mounting terminal protrudes from the back surface of the silicon substrate. A wiring layer is formed on the front surface of the silicon substrate. The wiring layer includes a conductive layer that is electrically connected to the mounting terminal.

Description

technical field [0001] The present invention relates generally to semiconductor device substrates, and more particularly to a semiconductor device substrate and a method of manufacturing the same using a silicon substrate having fine lines formed thereon. Background technique [0002] With the high integration of semiconductor devices, the distance between mounting ends of semiconductor devices is getting smaller and smaller. However, since the pitch of the connection terminal pads of the circuit board on which the semiconductor device is mounted is larger than the mounting terminal pitch of the semiconductor device, it is difficult to mount the semiconductor device as it is. [0003] Therefore, the semiconductor device is mounted on a substrate called an interposer, so that the semiconductor device is mounted on the circuit board through the interposer. That is, the electrodes of the semiconductor device are rearranged by the interposer to form mounting terminals with a la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/12H01L21/48H01L21/56H01L21/68H01L23/14H01L23/31H01L23/32H01L23/498
CPCH01L2224/73203H01L23/147H01L23/3121H01L2924/01082H01L2221/68345H01L2924/01004H01L21/4846H01L2224/48095H01L2224/16H01L2924/09701H01L2224/4809H01L2924/15311H01L2924/01029H01L2224/13099H01L2924/01022H01L23/49822H01L21/563H01L2924/01087H01L2924/014H01L2924/01013H01L2924/01024H01L2224/32225H01L2924/01047H01L2224/73204H01L24/48H01L2924/01079H01L2224/48465H01L24/16H01L2224/48227H01L21/6835H01L2924/01005H01L2924/01033H01L2924/01006H01L2924/01078H01L2224/45144H01L2224/16225H01L2224/73265H01L2924/15787H01L2924/00014H01L24/45H01L2924/181H01L24/73H01L2224/05573H01L2224/05568H01L2924/00012H01L2924/00H01L2224/05599H01L23/12
Inventor 米田义之南泽正荣渡边英二佐藤光孝
Owner SOCIONEXT INC