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Electronic device and its producing method and electronic equipment

A technology of electronic devices and manufacturing methods, which is applied to identification devices, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as position displacement, difficult to eliminate electrode position displacement, and electrodes not being connected

Inactive Publication Date: 2003-09-10
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the past, when connecting multiple electrodes, as in COF (Chip On Film), which is connected to a flexible printed circuit board on a liquid crystal panel, positional displacement occurs and the electrodes cannot be connected.
In particular, electrodes that form a thin resin film in the form of a flexible printed circuit board, since the resin film tends to expand or shrink due to heat and moisture, it is difficult to eliminate the displacement of the electrode.

Method used

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  • Electronic device and its producing method and electronic equipment
  • Electronic device and its producing method and electronic equipment
  • Electronic device and its producing method and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079] figure 1 A~ Figure 4 B is a diagram for explaining the method of manufacturing the electronic device according to Example 1 of the present invention.

[0080] (design phase)

[0081] figure 1 A is a diagram showing the electronic device at the design stage. The electronic device has a plurality of electronic components (first and second electronic components 10, 20). figure 1 The first electronic component 10 shown in A is an electro-optical panel (for example, a liquid crystal panel or an electroluminescence panel). The first electronic component 10 has a first group of terminals 12 . The first group of terminals 12 is formed on a substrate (for example, a glass substrate) 14 of the first electronic component 10 . The first group of terminals 12 consists of three or more terminals, and may be a part of the wiring pattern. The first electronic component 10 has a pair of first marks 16 . The first mark 16 may be formed of the same material as the first group ter...

Embodiment 2

[0104] Figure 5 A~ Figure 5 B is a diagram for explaining a method of manufacturing an electronic device according to Example 2 of the present invention. Specifically Figure 5 A is a diagram showing first and second sets of terminals and first and second marks for explaining the design stage. Figure 5 B is a diagram showing first and second progenitor terminals and first and second marks for explaining the position correction stage.

[0105] In this embodiment, in the first electronic component 40, a pair of first marks 46 are part of a pair of respective terminals in the first group of terminals 42 as a reference for the distance W, that is, the first marks 46 are located in the first group on any terminal 42 of the In addition, in the second electronic component 50, a pair of second marks 56 are respectively a part of a pair of respective terminals as a reference for the distance W in the second group of terminals, that is, the second marks 56 are located on any term...

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PUM

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Abstract

An electronic device capable of ensuring electrical continuity, and a manufacturing method thereof are provided, first and second electronic components (10), (20) are disposed so that a first and a second X axis X1, X2 coincide with each other and a first and a second Y axis Y1, Y2 coincide with each other. The first and second electronic components (10), (20) are moved in directions, in which a first point and a second point P1, P2 approach each other, and along the first and second Y axes Y1, Y2 by an approximated distance delta Y between the first and second points P1, P2.

Description

technical field [0001] The present invention relates to an electronic device, its manufacturing method, and electronic equipment. Background technique [0002] Conventionally, when a plurality of electrodes are connected, such as COF (Chip On Film) which is connected to a flexible printed circuit board on a liquid crystal panel, positional displacement occurs and the electrodes cannot be connected. In particular, for electrodes formed of a thin resin film in the form of a flexible printed wiring board, since the resin film tends to swell or shrink when exposed to heat and moisture, it is difficult to eliminate displacement of the electrodes. Contents of the invention [0003] An object of the present invention is to provide an electronic device capable of being electrically connected, a method of manufacturing the same, and an electronic device. [0004] (1) The method for manufacturing an electronic device of the present invention includes a first group of terminals cons...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13G02F1/1345G09F9/00H01L21/60
CPCG02F1/13452G02F1/1345
Inventor 仓泽宗宪
Owner SEIKO EPSON CORP