Injection moulding method for stylus

A technology of stylus and pen body, which is applied in the direction of coating, etc., can solve the problems of high mold cost, difficult positioning of stylus, unreasonable ratio of input and output, etc.
CN1485194AInactive Publication Date: 2004-03-31MITAC COMP (SHUN DE) LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
MITAC COMP (SHUN DE) LTD
Publication Date
2004-03-31
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses an injection moulding method for touch pens, in order to guarantee the moulding quality, the touch pen can be achieved through the injection moulding of three sets of dies, placing the inner pen units in sequence into the main spray dies. the tough pen is injected though the sequence of sequence end, intermediate section and the fastening end, which improves the quality oftouch pen injection. íí
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Description

technical field

[0001] The present invention mainly relates to the field of injection molding of touch pens used in electronic products, in particular to an injection molding method of touch pens (touch pen) used in electronic products and a fixing tool used in the injection molding process. Background of the invention

[0002] Most PDA manufacturers generally use a set of main injection molds to inject the touch pen at one time during the injection molding process of the touch pen. Although the injection molding process of this method is simple, the injected touch pen is easy. Bending occurs, making it difficult to guarantee its straightness. At the same time, the cost of making this set of molds is very high, especially in occasions where the product output is not large, and there may even be an unreasonable ratio of input to output. In addition, during the injection molding process The positioning of the stylus is difficult to guarantee.

[0003] Therefore, it is necessa...

Claims

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