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Fabricating method for printed circuit board

A technology of printed circuit and manufacturing method, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit components, etc., and can solve the problem that the thickness of the substrate does not meet the requirements of electrical characteristics, etc.

Inactive Publication Date: 2004-08-18
MEJIRO PRECISION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, multilayer printed circuit wiring boards use ceramic substrates, laminated boards, composite laminated boards, etc. as their substrates, and the thickness of the substrate does not meet the requirements for electrical characteristics.

Method used

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  • Fabricating method for printed circuit board
  • Fabricating method for printed circuit board
  • Fabricating method for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0058] Using an 8-inch silicon wafer (thickness: 200 μm; nominal diameter: 200 mm), 20 printed wiring boards were manufactured in the following manner.

[0059] 1. Jigs for substrate material support

[0060] Fixtures with the following specifications are used (see image 3 )

[0061] ·Longitudinal: 230mm

[0062] · Horizontal: 230mm

[0063] ·Thickness: 1mm

[0064] · Opening diameter: 196mm

[0065] · Step width: 2mm

[0066] ・The formation range of the step part: the entire circumference

[0067] ・Inclination of the upper slope: about 7.6°

[0068] ・Inclination of the lower slope: about 4.6°

[0069] 2. Film covering

[0070] Using a vacuum laminator (manufactured by Nichigo-Mo-ton Co., Ltd., CVA MODEL 725), both sides of the silicon wafer placed on the stepped portion of the above-mentioned jig were placed on each of the dry films for the jig (Nichigo-Mo-ton Co., Ltd. NIT315; thickness: 15 μm) covering, the silicon wafer is adhered and fixed on the jig, and then,...

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PUM

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Abstract

A method for manufacturing a very-thin printed wiring board a plurality of which can be stacked, characterized by comprising the steps: A. preparing a silicon wafer (20) having a thickness of 50 to 300 [micro]m; B. attaching the silicon wafer (20) to a jig (10) for holding only the edge of the silicon wafer (20), covering the whole surface of the silicon wafer (20) with a film, and fixing the silicon wafer (20) to the jig (10); C. patterning the film to expose the front and back faces of the silicon wafer (20); D. making a through hole in a predetermined position of the exposed silicon wafer (20), and forming a metallic thin film on the exposed surface of the silicon wafer (20) having the through hole; and E. patterning the metallic thin film, and performing etching so as to produce a predetermined conductor pattern.

Description

technical field [0001] The present invention relates to a method of manufacturing a printed wiring board using an ultra-thin silicon wafer as a base material. Background technique [0002] Corresponding to the requirement of high-density mounting of electronic components, a multilayer circuit board (multilayer printed circuit wiring board) is also used for the printed circuit wiring board. However, multilayer printed circuit wiring boards use ceramic substrates, laminated boards, composite laminated boards, etc. as their substrates, and the thickness of the substrate does not meet the requirements for electrical characteristics. Contents of the invention [0003] An object of the present invention is to provide a method of manufacturing an extremely thin printed wiring board capable of producing a multi-stage laminated printed wiring board. [0004] That is, the present invention is a method of manufacturing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/687H05K1/03
CPCH05K1/0306H01L21/68778H01L21/68735H01L21/4846H01L21/68721H05K3/06
Inventor 上原诚
Owner MEJIRO PRECISION