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Lithographic apparatus and device manufacturing method

A lithographic projection and component technology, which is used in semiconductor/solid-state device manufacturing, photolithography process exposure devices, microlithography exposure equipment, etc. Problems such as resist T-type topping

Active Publication Date: 2005-02-02
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This causes poor performance in the upper layer of photoresist
Additionally, the non-uniform nature of the photoresist after degradation can cause T-topping during development
The developer dissolves the areas under the photoresist that were not degraded during immersion, but the degraded areas at the surface are not developed uniformly

Method used

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  • Lithographic apparatus and device manufacturing method
  • Lithographic apparatus and device manufacturing method
  • Lithographic apparatus and device manufacturing method

Examples

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Embodiment 1

[0041] figure 1 A lithographic projection apparatus according to a specific embodiment of the present invention is schematically shown. The devices include:

[0042] a radiation system Ex, IL, said radiation system Ex, IL for supplying a projection beam PB of radiation such as DUV (deep ultraviolet) radiation, in this particular case the radiation system Ex, IL also comprising a radiation source LA ;

[0043] a first object table (mask table) MT equipped with a mask holder for holding a mask such as a reticle and connected to the first positioning means, the aforementioned first positioning means are used to precisely position the mask relative to the object PL;

[0044] A second object stage (substrate stage) WT equipped with a substrate holder for holding a substrate (for example, a resist-coated silicon wafer) W and connected to on the second positioning device, the above-mentioned second positioning device is used for precise positioning of the substrate relative to t...

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Abstract

A lithographic apparatus is provided. Exposure is carried out by projecting through a liquid having a pH of less than 7, the liquid being in contact with a substrate to be exposed. The liquid advantageously comprises an anti-reflective topcoat.

Description

technical field [0001] The present invention relates to a lithographic projection apparatus (lithographic projection apparatus), the lithographic projection apparatus comprising: [0002] - a radiation system for supplying a projection beam of radiation; [0003] - a support structure for supporting a patterning device for patterning the projection beam in a desired pattern; [0004] - a substrate table for holding a substrate; [0005] - a projection system for projecting the aforementioned patterned light beam onto a target portion of the substrate; and [0006] - A liquid supply system for filling the space between the terminal element of said projection system and said substrate with a liquid. Background technique [0007] The term "patterning device" as used herein should be broadly understood to refer to a device which can be used to cause an incident radiation beam to have a patterned cross-section corresponding to an object to be deposited on a substrate. The pat...

Claims

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Application Information

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IPC IPC(8): G03F7/20H01L21/027
CPCG03F7/70341G03F7/70866G03F7/70958G03F7/2041G03F7/70875
Inventor B·斯特雷克M·M·T·M·蒂里奇斯W·F·J·格霍-范安塞姆
Owner ASML NETHERLANDS BV
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