The application belongs to the technical field of ultrasonic scanning, and particularly relates to a high-frequency ultrasonic probe and a preparation method thereof. The method comprises the following steps: S1, obtaining a conductor column and a piezoelectric film plated with electrodes on two surfaces after polarization; S2,
processing a first end of the conductor column into a spherical arc surface and a first anti-reflection surface, and
processing a second end of the conductor column into a second anti-reflection surface to form a backing; S3, coaxially fixing a first surface of the piezoelectric film to the spherical arc surface and the first anti-reflection surface; S4, sleeving an insulating inner shell around the backing, wrapping a shielding net around an outer side of the inner shell, bonding the shielding net to a second surface of the piezoelectric film through conductive glue, connecting a ground wire to the second anti-reflection surface, and connecting a
signal wire to the shielding net to form a
transducer; and S5, packaging the
transducer into a
metal shell as a whole, grounding the
metal shell through a standard interface, and obtaining the high-frequency ultrasonic probe by plating a waterproof layer on the
metal shell and the second surface of the piezoelectric film after packaging, which can be used for ultrasonic
nondestructive testing.