Nozzle device and substrate processing device with nozzle device

A technology of a substrate processing device and a nozzle device, which is applied in the direction of spraying devices, spraying devices, and devices for coating liquid on surfaces, etc., and can solve problems such as the inability to form a processing liquid film, the inability to coat the processing liquid, and the thickness of the processing liquid.

Inactive Publication Date: 2005-06-15
SUMITOMO PRECISION PROD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] However, in the nozzle device 100, since the discharge holes 105 are arranged in a row, if the distance between the holes is too narrow, the intervals of the liquid streams discharged from the discharge holes 105 are very close to each other. As a result, the adjacent liquid streams are joined together and mixed with each other, not only forming a ribbon-shaped liquid stream and flowing down, but also the width of the liquid stream is in a state of front-end contraction due to the effect of its surface tension, resulting in the treatment liquid cannot be coated to the problem on the entire substrate W width
In addition, there is also a problem that the thickness of the applied treatment liquid is too thick.
[0016] On the one hand, when the spacing between mounting holes is increased so that adjacent liquid streams do not stick together, since the amount of processing liquid discharged from each discharge port is too small, as shown in FIG. 17 , each liquid drop placed on the substrate W R cannot be in contact with each other and is in an independent state, so it is impossible to form a processing liquid film on the substrate W

Method used

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  • Nozzle device and substrate processing device with nozzle device
  • Nozzle device and substrate processing device with nozzle device
  • Nozzle device and substrate processing device with nozzle device

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Embodiment Construction

[0053] Hereinafter, in order to describe this invention in more detail, it demonstrates based on drawing.

[0054] As shown in FIGS. 1 and 2 , a substrate processing apparatus 1 in the present invention includes a cover 2 forming a closed space, and a plurality of transfer rollers 4 installed at predetermined intervals in the closed space. It also includes a conveying device 3 that supports and conveys the substrate W as the processing object through the conveying roller 4; a nozzle device 10 that is installed above a series of conveying rollers 4 and applies a processing liquid on the substrate W; The nozzle device 10 supplies a processing liquid supply device 37 and the like of a pressurized processing liquid.

[0055] In addition to the above-mentioned multiple conveying rollers 4 , the conveying device 3 also includes a bearing 8 capable of rotatably supporting the conveying rollers 4 and a driving mechanism 9 capable of driving each conveying roller 4 . The conveying rol...

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PUM

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Abstract

A nozzle device and a substrate processing device capable of preventing liquid from dripping after completing the application of the liquid and forming processing liquid film of uniform thickness no a substrate with small amount of processing liquid, the nozzle device comprising a plruality of outlets formed in the lower surface thereof, a liquid reserving chamber for reserving the supplied processing liquid, and a plurality of liquid discharge flow passages allowed to communicate with the outlets for discharging the processing liquid from the outlets, wherein the upper ends of the liquid discharge flow passages are positioned above the upper end of the liquid reserving chamber and the liquid discharge flow passages are allowed to communicate with the liquid reserving chamber through a communication passage, and the minimum height dimension of the communication passage is set to 0.05 to 0.2 mm and the minimum diameter of the liquid discharge flow passages is set to 0.35 to 1.0mm.

Description

technical field [0001] The present invention relates to a nozzle device for spraying processing liquids such as chemical liquid or washing liquid on liquid crystal glass substrates, semiconductor wafers (silicon wafers), glass substrates used for photomasks, substrates used for optical discs, etc. substrate processing equipment. Background technique [0002] For example, a glass substrate constituting a liquid crystal substrate is manufactured through various processes in which a protective film or a developer is applied to the glass substrate, and various treatment solutions such as a chemical solution for peeling or a cleaning solution are applied. [0003] The coating of the treatment liquid on the glass substrate is performed by the nozzle device shown in Fig. 15 and Fig. 16 . The nozzle device includes: a support mechanism for horizontally supporting the glass substrate; a nozzle device for discharging the treatment liquid onto the horizontally supported glass substrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05B1/14B05B1/20B05C5/00B05C5/02B65G49/07H01L21/00H01L21/027H01L21/304
CPCB05C5/027B05B1/20H01L21/6715
Inventor 水川茂村田贵中田胜利松元俊二赤坂丈士
Owner SUMITOMO PRECISION PROD CO LTD
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