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Modular connector with grounding interconnect

A technology of electrical connectors and grounding components, which is applied to the parts of the connecting device, the protective grounding/shielding device of the connecting parts, and the connection, etc., which can solve the problems of increasing crosstalk

Active Publication Date: 2005-08-03
TE CONNECTIVITY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Potential buildup between the ground planes causes the ground planes to resonate at specific frequencies, causing pass signal degradation (insertion loss) and increasing crosstalk between signal lines on the die

Method used

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  • Modular connector with grounding interconnect
  • Modular connector with grounding interconnect
  • Modular connector with grounding interconnect

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] figure 1 A plug 2 formed according to an embodiment of the invention is shown. The plug 2 is arranged to mate with a socket (not shown) to form a right-angle connector assembly (not shown). The plug 2 includes a connector housing 4 and a plurality of signal modules 6 installed in the connector housing 4 . The signal modules 6 are arranged parallel to each other and spaced apart by a gap 8 . The signal module 6 comprises mating ends 10 and 12 forming right angles to each other. The mating end 10 includes pads 14 for mating with contacts (not shown) having downwardly projecting pins 16 . The pins 16 are arranged to be inserted into via holes of a sub-printed circuit board (PCB) (not shown). The mating end 12 includes solder pads 18 arranged to mate with a base PCB (not shown). The signal module includes side surfaces 20 and 22 with a ground potential plane 24 and a signal line 28 . For example, each signal module 6 includes six ground potential planes 24 and four si...

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PUM

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Abstract

An electrical connector is provided having a connector housing with signal modules and grounding members therein. Each of the signal modules has a ground plane on at least one side of each of the signal modules. The ground planes have contact pads formed at opposite ends thereof proximate mating ends of the signal modules. The grounding members interconnect the ground planes on the sides of adjacent signal modules to one another at a point along one of the ground planes and the contact pads. Optionally, the signal modules may include vias having conductive liners therethrough that electrically connect ground planes from opposite sides of a signal module to one another. Alternatively, the signal modules can be printed circuit boards. The signal modules may be arranged parallel to one another within the housing.

Description

technical field [0001] The invention relates to an electrical connector, in particular to a high-speed, high-density board-to-board connector. Background technique [0002] Modular connectors already exist for connecting various circuit boards, such as daughter cards, motherboards, backplanes, etc. Modular connectors transmit densely assembled multiple signal lines between circuit boards. Each modular connector includes a plurality of die or signal modules stacked in parallel. Both sides of the wafer have a ground potential plane and signal lines formed on the ground potential plane. Signal lines carry data between mating ends of the chip, while ground planes control impedance. Signal lines may be routed on adjacent dies so as to form differential pairs. In differential pair applications, signals are split and transmitted in a first direction over a pair of conductors (thus through a pair of pins or contacts). The return signals are similarly split and travel in opposit...

Claims

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Application Information

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IPC IPC(8): H01R12/16H01R12/71
CPCH01R23/005H01R23/688H01R12/724H01R23/7073H01R13/6586H01R13/6471H01R13/648
Inventor 布伦特·R·罗瑟梅尔迈克尔·J·菲利普斯亚历山大·M·沙夫戴维·W·赫尔斯特兰德尔·R·亨利詹姆斯·L·费德林恩·R·赛普戴维·K·福勒阿塔利·S·泰勒
Owner TE CONNECTIVITY CORP