Refurbishment of a coated chamber component

Abstract

A component of a process chamber is cleaned and refurbished. The component has a structure with an overlying coating having of a first layer. To refurbish the component, the first layer is removed to form an exposed surface on the structure. During or after the removal of the coating, the exposed surface is cleaned with a cleaning fluid, which deposits cleaning residue on the exposed surface. The exposed surface is heated in a substantially non-oxidizing atmosphere to a temperature that is sufficiently high to vaporize the cleaning residue from the surface, thereby forming a cleaned surface. A second layer is formed over the cleaned surface.

Description

Background technique [0001] The present invention relates to the cleaning and coating of process chamber components. [0002] In the processing of substrates, such as semiconductor wafers and display panels, the substrate is placed in a processing chamber and exposed to process gases to deposit or etch materials on the substrate. During this process, process residues are produced and may deposit on the inner surfaces of the chamber. For example, in a sputter deposition process, the material sputtered from the target for deposition onto the substrate is also deposited on the surfaces of other components within the chamber, such as deposition rings, shadow rings, On wall liners and focus rings. During subsequent processing cycles, deposited process residues can "scale" from the chamber surfaces onto and contaminate the substrate. [0003] To reduce contamination of the substrate by process residues, the surface of the components in the chamber can be made uneven. Process res...

AI Technical Summary

Problems solved by technology

However, it has been found that this pre-baking process results in unsatisfactory adhesion of coating layers subsequently applied to the underlying structure

Coating layers with low adhesion can flake off from underlying structures, leading to destruction of underlying structures and contamination of substrates processed in the chamber

Also, with this prebaked part, the pumping time required to achieve the proper chamber pressure is still unacceptably long

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