Unlock instant, AI-driven research and patent intelligence for your innovation.

High efficiency slot fed microstrip antenna having an improved stub

A technology of microstrip antenna and slot, applied in the direction of electrical short antenna, antenna, resonant antenna, etc., can solve problems such as limiting the performance of antenna circuit, and achieve the effect of optimizing performance

Inactive Publication Date: 2006-06-07
HARRIS CORP
View PDF0 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the impedance bandwidth of the stub is usually smaller than that of the radiator and the impedance bandwidth of the slot
Therefore, although conventional stubs can often be used to demodulate the over-reactance of an antenna circuit, the low impedance bandwidth of the stub usually limits the performance of the overall antenna circuit

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High efficiency slot fed microstrip antenna having an improved stub
  • High efficiency slot fed microstrip antenna having an improved stub
  • High efficiency slot fed microstrip antenna having an improved stub

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] Low dielectric constant plate materials are generally chosen for RF designs. For example, RT / duroid® 6002 (dielectric constant 2.94; loss tangent 0012) and RT / duroid® 5880 ( Dielectric constant 2.2; loss tangent .0007) polytetrafluoroethylene (PTFE) based composite. Both materials are common board material choices. These above materials have uniform thickness and physical properties over the plate area and provide a dielectric layer with a relatively low dielectric constant accompanied by a low loss tangent. The relative permeability of these two materials is close to 1.

[0033] Prior art antenna designs use nearly uniform dielectric materials. Uniform dielectric properties require a compromise in antenna performance. For loss considerations and antenna radiation efficiency, low-permittivity substrates are preferred for transmission lines, while high-permittivity substrates are preferred for minimizing antenna size and optimizing energy coupling. Therefore, conven...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A slot-fed microstrip antenna (100) with an improved stub (118) provides enhanced efficiency through more efficient coupling of electromagnetic energy between the feed (117) and the slot (106). A dielectric layer (105) disposed between the feed line (117) and the ground plane (108) provides a first region (112) with a first relative permittivity and at least one second region with a second relative permittivity (113). The second relative permittivity is higher than the first relative permittivity. The stub (118) is provided in the high dielectric constant region (113). The dielectric layer may contain magnetic particles preferably disposed below the stub.

Description

Background technique [0001] RF circuits, transmission lines, and antenna elements are usually fabricated on specially designed substrates. Conventional circuit board substrates are typically formed by processes such as casting or spray coating, which generally result in uniform substrate physical properties, including uniform dielectric constants. [0002] For RF circuit applications, it is often important to maintain careful control of the impedance characteristics. If the impedances of different parts of the circuit do not match, signal reflections and inefficient power transfer can result. The electrical length of transmission lines and radiators in these circuits can be a critical design factor. [0003] Two key factors affecting circuit performance involve the dielectric constant of the dielectric substrate material (sometimes called the relative permittivity or ε r ) and the loss tangent (sometimes called the loss factor or δ). The dielectric constant determines the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/38H01QH01Q1/00H01Q1/48H01Q9/04
CPCH01Q1/38H01Q9/0407H01Q1/48H01Q9/0485H01Q13/085H01Q13/106
Inventor 威廉姆·D·基伦兰迪·T·皮克赫里伯托·J·戴尔噶多
Owner HARRIS CORP