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Magnetic sensor and sensor device

A magnetic sensor and magnetic technology, applied in the field of magnetic sensors, can solve the problems of increasing the manufacturing cost, increasing the steps of the magnetic sensor unit, the arrangement of the magnetic sensor 61, etc.

Inactive Publication Date: 2006-10-04
YAMAHA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This increases the number of steps to manufacture the magnetic sensor unit, thereby increasing its manufacturing cost
[0008] In addition, the conventional magnetic sensor unit 64 is difficult to accurately arrange the magnetic sensor 61 on the surface 63a of the board 63 so that the sensitive direction of the magnetic sensor chip 62 is perpendicular to the sensitive direction of the magnetic sensor chip 52.

Method used

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  • Magnetic sensor and sensor device
  • Magnetic sensor and sensor device
  • Magnetic sensor and sensor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0136] refer to figure 1 and 2 , describing the overall configuration of the magnetic sensor manufactured according to the first embodiment of the present invention. That is, put figure 1 The magnetic sensor 1 is designed to measure the direction and magnitude of an applied external magnetic field. The magnetic sensor 1 includes two magnetic sensor chips 2 and 3, and a plurality of magnetic sensor chips 2 and 3 are used to electrically connect the magnetic sensor chips 2 and 3 with an external device (not shown). The connected leads 4 and the molded resin case 5 are used to integrally fix the magnetic sensor chips 2 and 3 and the leads 4 inside.

[0137] In plan view, the magnetic sensor chips 2 and 3 are each formed in a rectangular plate shape, and are mounted on platforms 6 and 7, respectively. Both the magnetic sensor chips 2 and 3 are encapsulated in a molded resin case 5 having a lower surface 5a and an upper surface 5c arranged closer to the upper surface 5c compar...

no. 3 example

[0275] refer to Figure 45 and 46 , describes the composition of the magnetic sensor manufactured by the manufacturing method according to the third embodiment of the present invention, wherein the magnetic sensor 201 is designed to measure the magnetic direction and magnitude of the applied external magnetic field. The magnetic sensor 201 includes: two magnetic sensor chips 202 and 203; a plurality of lead wires 204 for electrically connecting the magnetic sensor chips 202 and 203 with an external device (not shown); and a molded resin case 205 for integrally fixing the The magnetic sensor chips 202 and 203 and the leads 204 at predetermined positions are encapsulated in resin.

[0276] Both magnetic sensor chips 202 and 203 are formed substantially in a rectangular plate shape in plan view, and are mounted on platforms 206 and 207 , respectively. Both the magnetic sensor chips 202 and 203 are embedded in the molded resin case 205 , wherein the magnetic sensor chips 202 and...

no. 4 example

[0320] Before describing the fourth embodiment of the present invention in detail, refer to Figure 75 and 76 Describe its basic structure and concept, wherein the magnetic sensor 351 includes: a magnetic sensor chip 352; a plurality of leads 353 for electrically connecting the magnetic sensor chip 352 with an external device (not shown); and a molding resin 354 for These elements are integrally fixed at predetermined positions in the molding resin.

[0321] The magnetic sensor chip 352 is arranged in the X-Y plane defined by the X-axis and the Y-axis on the stage 355, thereby detecting the components of the external magnetic field in the X-axis direction and the Y-axis direction.

[0322] The base 353 a of the lead wire 353 is electrically connected to the magnetic sensor chip 352 via the metal wire 356 , and the tip 353 b of the lead wire 353 protrudes from the surface of the molding resin 354 .

[0323] The magnetic sensor 351 described above is used in various fields, ex...

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Abstract

A magnetic sensor (1) is constituted using magnetic sensor chips (2, 3) mounted on stages (6, 7) supported by interconnecting members (12, 13) and a frame (9) having leads (4) in a lead frame (10). Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads (4). Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefor.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 03155507.1 filed by Yamaha Corporation on July 28, 2003, entitled "Magnetic Sensor Manufacturing Method and Its Lead Frame". technical field [0002] The invention relates to a magnetic sensor for measuring azimuth (or azimuth). The invention also relates to a sensor device. Background technique [0003] Typically, magnetic sensors are used to detect magnetism in order to measure orientation with respect to an applied external magnetic field. [0004] Figure 83 A conventionally known magnetic sensor unit 64 is shown in which the magnetic sensors 51 and 61 are arranged on a surface 63 a of a board (or substrate) 63 . The magnetic sensor unit 64 can three-dimensionally measure the orientation of an external magnetic field. [0005] Specifically, the magnetic sensor 51 includes a magnetic sensor chip 52 sensitive to components of an external magnetic field in two directions, wherein two sen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L43/00G01R33/02
CPCH01L2924/01005H01L2224/49171H01L2224/48091H01L2224/48247H01L2924/181
Inventor 足立浩司齐藤博白坂健一佐藤秀树大村昌良
Owner YAMAHA CORP