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Extended life sputter target

A technology of sputtering target and target base, applied in the field of recessed sputtering target, can solve the problems of limited chamber operating temperature, low output, and inability to provide welding

Inactive Publication Date: 2006-10-18
PRAXAIR ST TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As the sputtering temperature increases and the target size increases, soldering does not provide the necessary bonding due to the following disadvantages: 1) the low melting temperature limits the chamber operating temperature; 2) the high vapor pressure of the solder introduces impurities into the chamber; and 3) low bond strength especially at high temperature leading to occasional bond failure
Low throughput due to preferential sputtering in the central region leaves opportunity for improved target utilization

Method used

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  • Extended life sputter target
  • Extended life sputter target
  • Extended life sputter target

Examples

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example

[0030] A commercial 99.99% pure titanium disc with a diameter of 13.572" (34.5 cm) x a thickness of 0.750" (1.9 cm) was machined at a 3° angle on the rear bonding surface. The rear bonding surface of the disc forms a cone-like shape. The titanium disc is seated in a cylindrical recess machined into the 6061-T6 aluminum disc. The recess contained a volume equal to the volume of the titanium target insert. The hot isostatic pressing process at 15 ksi (103 MPa) and a temperature of 510° C. for 2 hours bonded the insert to the target holder. The aluminum disk becomes plastic during the hot isostatic pressing cycle and conforms to the shape of the 3° angle of the tapered titanium target. The plastic deformation that occurs during the hot isostatic pressing process ensures a tight solid-state bond. The bonding performance is evaluated by ultrasonic test, tensile test and metallographic method to confirm the integrity and strength of the bond.

[0031] Ultrasonic test analysis pe...

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Abstract

A method of manufacturing a sputtering target assembly (20) and a product thereof are provided. The method includes fabricating a target holder (26) having a planar top surface and a cylindrical recess therein. A near-net-shape target insert (22) is subsequently fabricated having a frusto-conical rear surface (24) and front surface corresponding to said cylindrical recess (28) of said target seat (26). The target insert (22) has a yield strength greater than that of the target holder (26), and a height greater than the depth of the cylindrical recess in the target holder (26). Thereafter, the target insert (22) is hot pressed into the cylindrical recess (28) of the target holder (26) to a plastically deformed state in order to diffusion bond the target insert (22) to the The target assembly (20) is formed on the target seat (26). The target insert (22) protrudes above the planar front surface of the target holder (26).

Description

technical field [0001] The present invention relates to the field of recessed sputtering targets, and in particular, the present invention relates to a method of manufacturing a recessed sputtering target. Background technique [0002] In the field of sputtering target manufacture, various devices bond the target material to a target backing plate. Historically, target manufacturers have welded targets to target holders. see figure 1 , a conventional sputtering target assembly 10 is formed by bonding a target insert 12 to a target holder 14 . As the sputtering temperature increases and the target size increases, soldering does not provide the necessary bonding due to the following disadvantages: 1) the low melting temperature limits the chamber operating temperature; 2) the high vapor pressure of the solder introduces impurities into the chamber; and 3) Low bond strength especially under high temperature conditions leads to occasional bond failures. Since a detached targ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/32B23K20/02B23K28/00C23C14/34
CPCB23K20/023C23C14/3407B23K20/002
Inventor R·佩罗特T·J·洪特H·J·柯尼希斯曼P·S·吉尔曼
Owner PRAXAIR ST TECH INC