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Substrate heat treatment apparatus

A technology for heat treatment device and substrate, which is applied in lighting and heating equipment, furnace components, furnace types, etc., can solve the problems that the temperature balance of the baking plate cannot be fully utilized, and the temperature treatment balance of the substrate cannot be improved, so as to achieve the effect of balanced heat treatment.

Active Publication Date: 2006-11-15
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that in the heat treatment of the substrate, the high-precision temperature balance inherent in the baking plate cannot be fully utilized.
However, since the amount and direction of warpage of the substrates are different, it is necessary to implement the most suitable temperature control for each substrate. In practice, it is not easy to implement, and even if it is implemented, it cannot be controlled due to complicated control. And correspondingly improve the balance of substrate temperature treatment

Method used

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Examples

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Effect test

Embodiment 1

[0041] Next, Embodiment 1 of the present invention will be described with reference to the drawings.

[0042] figure 1 It is a longitudinal sectional view showing a schematic structure of a substrate heat treatment apparatus according to Example 1, figure 2 yes figure 1 top view of image 3 It is an enlarged longitudinal sectional view of a baking plate.

[0043] A baking plate 1 with a substrate W is mounted on the upper surface, and a heating element 3 such as a mica heating element is attached to the lower portion. A plurality of heat transfer pipes (not shown) are buried in the heat transfer portion 5 between the heating element 3 and the upper surface of the baking plate 1 . In addition, a cooling tank (not shown) is formed between a plurality of heat transfer pipes (not shown), and a fluid for cooling flows.

[0044] Three through-holes 7 penetrating from the upper surface to the lower surface are formed in the baking plate 1 . These through-holes 7 are formed at ...

Embodiment 2

[0059] Next, Embodiment 2 of the present invention will be described with reference to the drawings. in addition, Figure 8 It is a vertical cross-sectional view showing a schematic configuration of a substrate heat treatment apparatus according to Example 2. In the following description, the same reference numerals are assigned to the same structures as those of the first embodiment described above, and detailed descriptions will be omitted.

[0060] This embodiment 2 is to further design the upper surface of the baking plate 1A.

[0061] That is, on the upper surface of baking plate 1A, more specifically, on the upper surface of heat transfer portion 5A, the inner side of sealing portion 25 is formed in a concave shape or a shallow mortar shape depressed toward the center. When there is a warp (valley warp) in which the central part of the substrate W protrudes downward from the peripheral part, the central part may be sucked first and the peripheral part may not be suffic...

Embodiment 3

[0063] Next, Embodiment 3 of the present invention will be described with reference to the drawings. in addition, Figure 9 It is an enlarged longitudinal sectional view showing a part of the substrate heat treatment apparatus according to the third embodiment. In addition, the same reference numerals are assigned to the same configurations as in the first embodiment described above, so that detailed descriptions will be omitted.

[0064] The structure of the closing portion 25A of this embodiment 3 is different from that of the foregoing embodiments 1 and 2.

[0065] That is, closing portion 25A has support portion 21A and restricting portion 23 , and support portion 21A is constituted by contact portion 43 and groove portion 45 . The contact portion 43 has an inner diameter slightly smaller than the outer diameter of the substrate W, and the upper surface of the contact portion 43 is in contact with the lower surface of the outer periphery of the substrate W on the inner s...

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PUM

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Abstract

A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate having projections on an upper surface thereof, a seal unit disposed peripherally of the upper surface of the bake plate for closing a lateral area of a minute space formed between a lower surface of the substrate and the upper surface of the bake plate when the substrate is placed on the bake plate, and exhaust bores for exhausting gas from the minute space. The substrate placed on the bake plate is heat-treated in a state of the gas exhausted from the minute space through the exhaust bores.

Description

technical field [0001] The present invention relates to a substrate heat treatment apparatus for heat-treating substrates such as semiconductor wafers and glass substrates for liquid crystal display devices (hereinafter simply referred to as substrates), and more particularly relates to a technology for heat-treating substrates without being closely attached to a baking plate and through a small space . Background technique [0002] Conventionally, as this kind of device, can enumerate have the device that has the baking plate that carries out heating and cooling and 3 spheres that are buried in the mode that is positioned at each vertex of equilateral triangle in top view on the baking plate (for example Japanese Patent Laid-Open 2000- 193376). In this device, when the substrate is placed on the baking plate, the lower surface of the substrate is supported by three spheres, so that the entire lower surface of the substrate is not in close contact with the baking plate, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F27D3/00H01L21/02
CPCF27B5/04F27B17/0025F27D3/0084H01L21/67109H01L21/67126H01L21/68735H01L21/68742H01L21/6875H01L21/324
Inventor 森田彰彦后藤茂宏松近启司
Owner DAINIPPON SCREEN MTG CO LTD
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