Thin-plate supporting container
A thin plate and container technology, which is applied in the field of thin plate supporting containers, can solve the problems that the fitting protrusions are difficult to slide relative to each other, cannot simply locate the thin plate supporting containers, etc., and achieve the effect of reducing frictional resistance.
Inactive Publication Date: 2006-12-20
MIRAIAL CO LTD
View PDF1 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
As a result, it is difficult for the inclined surface 13 and the fitting protrusion on the side of the stage to slide relative to each other, and it is not easy to position the thin plate to support the container.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0016] Hereinafter, a thin-plate supporting container according to an embodiment of the present invention will be described with reference to the drawings.
[0017] The thin plate support container of the present invention is preferably applied to a container for storing, storing, and transporting thin plates such as semiconductor wafers, storage disks, and liquid crystal glass substrates. In this embodiment, a thin-plate support container for storing semiconductor wafers is taken as an example for description. The overall structure of the thin-plate supporting container according to this embodiment is basically the same as the aforementioned existing thin-plate supporting container. A brief description is given below.
[0018] Such as figure 1 As shown, the thin-plate supporting container 21 according to this embodiment mainly includes: a container body 22, which houses a plurality of semiconductor wafers (not shown); two thin-plate supporting parts (not shown), are disposed opp...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
When a thin-plate supporting container (21) is placed on a placement table, a misplacement can be corrected so that the thin-plate supporting container (21) is always precisely positioned. The thin-plate supporting container (21) includes a container body (22) for housing therein a semiconductor wafer and the like and positioning means (23) provided to the container body (22) for positioning the container body (22) at a set position on a placement table to place the container body (22) on the placement table and take a semiconductor wafer and the like into and out of the container body (22). The positioning means (23) includes an engagement groove (24) for engaging an engagement protrusion provided on the placement table, and an inclined plane (25) to be in contact with the engagement protrusion in a state wherein the engagement groove (24) engages with the engagement protrusion. The inclined plane (25) is embossed so as to reduce a contact area with the engagement protrusion to decrease the friction resistance therebetween.
Description
Technical field [0001] The invention relates to a thin plate supporting container including a positioning mechanism, which is used for positioning the container body on a set position of a bearing platform to take out the thin plate loaded inside. Background technique [0002] There is known a thin-plate support container used for automatic loading and unloading of semiconductor wafers and the like stored therein. Such a thin-plate support container includes a positioning mechanism for adjusting the position of the arm portion of the conveying device, the position of the semiconductor wafer, and the like. As an example of a thin-plate supporting container including such a positioning mechanism, the technique disclosed in International Application WO99 / 39994 is known. Refer to Figure 2 to Figure 4 The thin plate support container will be described. [0003] The thin-plate support container 1 shown in the figure includes: a container body 2 in which a plurality of semiconductor wa...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): B65D85/86B65D85/48H01L21/68
CPCH01L21/67379H01L21/00H01L21/68B65D85/30
Inventor 大林忠弘枝村洋一
Owner MIRAIAL CO LTD