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Conduction checking device and method for printed base plate

A technology of printed substrates and inspection devices, which is applied in the direction of measuring devices, printed circuits, and printed circuit manufacturing, and can solve problems such as inspections

Inactive Publication Date: 2007-03-07
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the defect in the half-broken state in the through hole 2 cannot be detected by the above-mentioned optical defect detection device.

Method used

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  • Conduction checking device and method for printed base plate
  • Conduction checking device and method for printed base plate
  • Conduction checking device and method for printed base plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Fig. 1 shows the inspection fixture 10 in the conduction inspection device related to the printed circuit board of the present invention. The inspection fixture 10 is composed of an upper fixture 20 and a lower fixture 30. The upper metal plate 20b and the upper contact probe 20c are combined, and the lower jig 30 is formed by combining the lower insulating plate 30a with the lower metal plate 30b and the lower contact probe 30c.

[0037] The upper and lower contact probes 20c, 30c are respectively fixed to the upper and lower insulating plates 20a, 30a, and the upper and lower contact probes 20c, 30c are pushed against the terminals 5 for inspection provided on the printed circuit board 4, and electricity is supplied. , to detect a wire break or short circuit.

[0038] Here, in the upper jig 20 , in a state where the printed board 4 is pressurized and held between the upper jig 20 and the lower jig 30 , at a position corresponding to the through hole 6 of the printed b...

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PUM

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Abstract

The invention relates to a conduction inspection device and a conduction inspection method of a printed substrate. The conduction inspection device of a printed substrate has an inspection jig, and the inspection jig keeps the heated printed substrate with through holes or via holes warm. Perform electrical continuity checks, prevent cooling of the printed circuit board during the electrical conduction test, and avoid applying pressure to through holes and via holes while applying pressure to the printed circuit board to correct waviness and warping. As a solution, the present invention provides a conduction inspection device for printed substrates. The device has the following structure. The inspection jig (10) is composed of an upper jig (20) and a lower jig (30). (20) and the lower jig (30), in the state where the printed substrate (4) is pressurized and held between the upper jig (20) and the lower jig (30), in the passage corresponding to the printed substrate (4), A non-through hole (21, 31) is provided at the position of the hole (6), and the through hole (6) avoids the pressurization caused by the upper clamp (20) and the lower clamp (30).

Description

technical field [0001] The invention relates to a conduction inspection device and a conduction inspection method of a printed substrate, in particular to a conduction inspection device and a conduction inspection method of a printed substrate with through holes or via holes. Background technique [0002] Conventionally, in inspections of such printed boards, electrical inspections are performed for disconnections in patterns or conduction short circuits between patterns. For example, the inspection fixture 1 shown in Figure 7 (1) is composed of an upper fixture 2 and a lower fixture 3, and the above-mentioned upper fixture 2 is formed by connecting the upper insulating plate 2a, the upper metal plate 2b and the upper contact detector 2c. The lower jig 3 is configured by combining the lower insulating plate 3a, the lower metal plate 3b, and the lower contact detector 3c. [0003] The upper and lower contact probes 2c, 3c are respectively fixed to the upper and lower insulat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/02H05K3/00
Inventor 吉川英哉
Owner NIPPON MEKTRON LTD