Surface structure of flip-chip substrate

Abstract

A surface structure of flip-chip base plate is prepared as defining chip connection region and passive element connection region on surface of base plate and separately setting the first electric-connecting pad and the second connecting pad on them, covering the first insulation layer with a patternized opening on chip connection region and exposing top surface of the first electric-connecting pad, covering the second insulation layer with a patternized opening on passive element connection region and exposing top surface of the second electric-connecting pad.

Description

technical field [0001] The invention relates to a flip-chip substrate, the surface of the substrate has two insulating layers, and a chip connection area and a passive component connection area are defined. Background technique [0002] With the development of portable electronic devices, various light, thin, and short packages are continuously being developed, and a flip-chip ball grid array (BGA) package is one example. In a flip-chip BGA package, the die is no longer connected to the package substrate by bonding pads (bonding pads) via gold wire bonding (wire bonding), but is reversed through solder bumps ( solder bump) or conductive polymer bump (conductive polymer bump) to connect to the package substrate, so the flip-chip BGA package can increase circuit density and improve electrical characteristics. [0003] Flip-chip bonding belongs to area array bonding, so it can be applied to extremely high-density packaging. To put it simply, the concept of flip-chip bonding i...

AI Technical Summary

Problems solved by technology

However, in the pre-solder printing process, it is often because each flip-chip substrate contains electrical connection pads of different sizes and distribution densities, such as the first electrical connection pad used as a chip electrical connection pad. And the second electrical connection pad of the passive component electrical connection pad, so when the solder mask layer used as a solder mask is prepared on the surface of a large substrate as a whole, the solder mask covering all parts of the board will occur If the layer is uneven, even because the flip-chip substrate 12 itself will have a warping phenomenon, when the subsequent pre-soldering printing process is performed, the entire board will be faced with pre-soldering printing in multiple chip connection areas, resulting in The quality of the pre-solder printing process is not easy to control, which leads to the phenomenon of large and small balls, uneven amount of pre-solder, and drop of solder balls during connection, which further leads to problems such as low product yield

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