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Method for electroplating bath chemistry control

A technology of electroplating baths and chemical agents, applied in chemical instruments and methods, organic chemistry, circuits, etc., can solve the problems of optimized inhibition and wettability of a single EO/PO copolymer, insufficient molecular structure dissimilarity EO/PO, etc.

Inactive Publication Date: 2007-05-02
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it is difficult to optimize both inhibition and wetting properties with a single EO / PO copolymer, and the introduction of a second EO / PO copolymer to optimize these properties has traditionally not been employed, in which case the combination of the two EO / PO copolymers Properties and molecular structures are not sufficiently dissimilar for EO / PO CVS activity to be measured independently

Method used

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  • Method for electroplating bath chemistry control
  • Method for electroplating bath chemistry control

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Embodiment Construction

[0016] The present invention generally provides a method for controlling the chemical composition of an electroplating bath solution for use in electroplating bath solutions by providing a small volume of electroplating bath configured to minimize additive decomposition, and discarding the electroplating bath after a predetermined bath life. Metal is deposited on the surface of the substrate. The present invention generally employs electrochemical plating cells of small volume, i.e., accommodating electrolytic plating cells in the range of between about 1 liter and 25 liters (preferably between about 10 and 20 liters) provided by adjacent fluidly connected tanks. A unit of liquid volume. The plating bath solution (plating fluid) is used to plate metal onto a number of substrates, eg 100 or more, over the predetermined lifetime of the plating fluid, after which the plating fluid is discarded and replaced with new plating fluid. Use these small volumes of plating fluid to minim...

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Abstract

A method for controlling the chemical composition of an electroplating bath solution used to plate a plurality of substrates by providing the electroplating bath solution to a small-volume plating cell configured to minimize additive breakdown, and discarding the electroplating bath after a predetermined bath lifetime. The method includes predetermining a lifetime of an electroplating bath solution having a desired chemical composition, combining a plurality of electroplating bath solution components thereby forming the electroplating bath solution having the desired chemical composition, filling a small-volume plating cell with the electroplating bath solution, plating a plurality of substrates in the electroplating bath solution until the bath lifetime is reached; and discarding the electroplating bath solution after the bath lifetime is reached.

Description

technical field [0001] Embodiments of the invention relate to methods for controlling the composition and chemistry of electroplating baths. Background technique [0002] Metallization of sub-quarter micron sized features is a fundamental technology for current and future integrated circuit manufacturing processes. More specifically, in devices such as VLSI devices (i.e., devices having integrated circuits with over a million logic gates), the multilayer microelectronic features (e.g., interconnects) at the core of these devices Typically formed by filling high aspect ratio (ie, greater than about 3:1) interconnect features with a conductive material such as copper. Typically, during electroplating, features with interconnections (e.g., trenches, lines, vias) are placed in contact with the plating bath solution, and between the substrate (cathode) and an anode (e.g., copper anode) placed within the plating solution ) to apply an electrical bias. This bias creates an elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/12C25D21/18A23D7/00A23D7/005A23D7/01A23J7/00C07F9/10C25D7/12H01L21/288
CPCA23D7/005A23J7/00C25D21/12A23D7/01C07F9/103A23D7/00C25D7/12H01L21/2885
Inventor 阿隆·罗森费尔德霍曼·哈非兹志-文·孙迈克尔·扬约瑟夫·本克
Owner APPLIED MATERIALS INC