Method for electroplating bath chemistry control
A technology of electroplating baths and chemical agents, applied in chemical instruments and methods, organic chemistry, circuits, etc., can solve the problems of optimized inhibition and wettability of a single EO/PO copolymer, insufficient molecular structure dissimilarity EO/PO, etc.
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[0016] The present invention generally provides a method for controlling the chemical composition of an electroplating bath solution for use in electroplating bath solutions by providing a small volume of electroplating bath configured to minimize additive decomposition, and discarding the electroplating bath after a predetermined bath life. Metal is deposited on the surface of the substrate. The present invention generally employs electrochemical plating cells of small volume, i.e., accommodating electrolytic plating cells in the range of between about 1 liter and 25 liters (preferably between about 10 and 20 liters) provided by adjacent fluidly connected tanks. A unit of liquid volume. The plating bath solution (plating fluid) is used to plate metal onto a number of substrates, eg 100 or more, over the predetermined lifetime of the plating fluid, after which the plating fluid is discarded and replaced with new plating fluid. Use these small volumes of plating fluid to minim...
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