Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Vertical heat treatment device and method of operating the same

A technology of heat treatment device and heat treatment furnace, which is used in thin material processing, transportation and packaging, electrical components, etc. Effect

Inactive Publication Date: 2007-06-13
TOKYO ELECTRON LTD
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, a corresponding space and equipment (storage room) are required, leading to an increase in size and cost of the device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vertical heat treatment device and method of operating the same
  • Vertical heat treatment device and method of operating the same
  • Vertical heat treatment device and method of operating the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0086] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic longitudinal sectional view showing a vertical heat treatment apparatus according to an embodiment of the present invention. Fig. 2 is a schematic transverse sectional view showing the vertical heat treatment apparatus of Fig. 1 .

[0087] In the above-mentioned drawing, the vertical heat treatment apparatus 1 of this embodiment is equipped with the heat treatment furnace 3 which has the furnace opening 3a below. The wafer boat 2 on which a plurality of (for example, about 50 to 150) semiconductor wafers to be processed are mounted in multiple stages in the vertical direction is accommodated in the heat treatment furnace 3 through the furnace mouth 3 a. The cover body 4 supporting the wafer boat 2 can close the furnace opening 3a. The heat treatment furnace 3 can heat-treat the wafers inside in a state where the furnace mouth 3a is closed (batch pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A vertical type of thermal processing apparatus of the present invention includes a thermal processing furnace having a furnace opening at a lower portion thereof. A boat holding objects to be processed in a tier-like manner in a vertical direction is adapted to be contained in the thermal processing furnace through the furnace opening. A lid supporting the boat is capable of closing the furnace opening. A transferring chamber is connected to the furnace opening. An elevating mechanism provided in the transferring chamber is configured to move up and down the lid in order to load and unload the boat into and out from the thermal processing furnace. A connecting port provided at a wall of the transferring chamber is capable of being connected to an opening of a conveying container for containing the objects to be processed. A first containing portion provided in the transferring chamber is capable of temporarily containing unprocessed objects to be processed for a next thermal process. A second containing portion provided in the transferring chamber is capable of temporarily containing processed objects to be processed conveyed out from the thermal processing furnace. A transferring mechanism transfers objects to be processed between the conveying container, the first containing portion, the second containing portion and the boat.

Description

technical field [0001] The invention relates to a vertical heat treatment device and an application method thereof. Background technique [0002] In the production of semiconductor devices, a vertical heat treatment apparatus capable of heat treating a plurality of objects such as semiconductor wafers (product wafers) at one time (multi-batch processing) is used. For example, as shown in Japanese Patent Laid-Open No. 2000-150400 and Japanese Patent No. 2681055, a vertical heat treatment apparatus includes a heat treatment furnace having a furnace opening below. A wafer boat holding a plurality of wafers (objects to be processed) in multiple stages in the vertical direction passes through the furnace opening and is accommodated in the heat treatment furnace. The cover supporting the crystal boat can block the furnace opening. The transfer chamber is connected to the above-mentioned furnace mouth. An elevating mechanism is provided in the transfer chamber to elevate the cov...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/22H01L21/324H01L21/68
CPCH01L21/67757H01L21/67109Y10S414/135H01L21/67781Y10S414/138H01L21/67178H01L21/22H01L21/324
Inventor 浅利聪三原胜彦
Owner TOKYO ELECTRON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com