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Differential comparison inspection method and apparatus thereof

A technology of differential comparison and inspection method, which is applied in the direction of measuring devices, analysis materials, image analysis, etc., can solve the problems of increasing cost, bad detection, affecting the performance of printed circuit boards, etc., and achieve the effect of improving processing speed

Inactive Publication Date: 2007-06-20
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, multiple circuits for determining the allowable value are required, which increases the cost
In addition, in the case of using the method disclosed in the above-mentioned JP Unexamined Publication No. 61-86639, although defects due to excessive etching and insufficient etching can not be detected at all, since there are no corners and corners Inspection is performed, and even if a defect that becomes a problem affecting the performance of the printed circuit board occurs at the corner or corner, it cannot be detected as a defect

Method used

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  • Differential comparison inspection method and apparatus thereof
  • Differential comparison inspection method and apparatus thereof
  • Differential comparison inspection method and apparatus thereof

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Embodiment Construction

[0046] Hereinafter, the difference comparison inspection device according to an embodiment of the present invention will be described with reference to the drawings. 1A and 1B are diagrams schematically showing the overall configuration of an optical appearance inspection apparatus 1 (hereinafter referred to as "inspection apparatus 1") as an example of the difference comparison inspection apparatus. That is, FIG. 1A is a plan view of the inspection device 1, and FIG. 1B is a front view of the inspection device 1. In FIGS. 1A and 1B, the inspection device 1 includes a table portion 11, a table support portion 12, a table drive mechanism 13, a base portion 14, a camera 15, a support member 16, a camera support portion 17, and a camera drive mechanism 18. .

[0047] The table portion 11 constitutes a horizontal table surface on the uppermost side. The inspection object, that is, the printed circuit wiring board S, is placed on the surface of the table of the table 11. The lower part...

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Abstract

An internal angle which is a recessed corner and an external angle which is a projecting angle formed on the pattern are detected respectively from a master image. Then, a range of an internal angle domain which is a domain near the detected internal angle is determined. Also, a range of an external angle which is a domain near the detected external angle is determined. Then, comparison inspection is performed based on a difference between the master image and an object image. In this case, the comparison inspection is performed by excluding a difference to an excessive domain which is a pattern domain of the object image formed more excessively than a pattern domain shown by the master image in the internal angle domain of the master image. The comparison inspection is performed by excluding a difference to the pattern domain of the object image formed more deficiently than the pattern domain shown by the master image in the external angle domain of the master image.

Description

Technical field [0001] The present invention relates to a difference comparison inspection method and device using images obtained by photographing an object to be inspected, and more particularly to a comparison inspection method and device for patterns formed on a substrate. Background technique [0002] On the surface of a printed circuit board equipped with electronic components, etc., conductor wiring required to form a predetermined circuit is patterned. The comparative inspection method is one of the inspection methods of this wiring pattern. This method is a method of comparing a non-defective product image made from CAD data with an inspection image obtained by photographing a substrate to be inspected, and detecting a part with a difference of a certain level or more as a defect. Specifically, the comparative inspection method detects defects based on the difference in the number of pixels between an image obtained by converting CAD data into a digital image, that is, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/956G01N21/88H05K3/00G06T7/00
CPCG06T7/0006G06T7/001
Inventor 浅井宣雄赤木佑司大西润
Owner DAINIPPON SCREEN MTG CO LTD