Method, apparatus and system for voltage compensation in a semiconductor wafer

Abstract

At least one method, apparatus and system disclosed involves performing a dynamic voltage compensation in an integrated circuit. A first voltage on a first portion of an integrated circuit is received. A second voltage on a second portion of the integrated circuit is monitored. A determination is made as to whether the second voltage fell below the first voltage by a predetermined margin. A feedback adjustment of the of the second voltage is performed in response to a determination that the second voltage fell below the first voltage by the predetermined margin; the feedback adjustment comprises performing a step up of the second voltage.

Description

BACKGROUND OF THE INVENTIONField of the Invention[0001]Generally, the present disclosure relates to the manufacture of sophisticated semiconductor devices, and, more specifically, to circuit for performing voltage compensation on a die of a semiconductor wafer.Description of the Related Art[0002]The technology explosion in the manufacturing industry has resulted in many new and innovative manufacturing processes. Today's manufacturing processes, particularly semiconductor manufacturing processes, call for a large number of important steps. These process steps are usually vital, and therefore, require a number of inputs that are generally fine-tuned to maintain proper manufacturing control.[0003]The manufacture of semiconductor devices requires a number of discrete process steps to create a packaged semiconductor device from raw semiconductor material. The various processes, from the initial growth of the semiconductor material, the slicing of the semiconductor crystal into individua...

AI Technical Summary

Benefits of technology

The patent is about a method for compensating for changes in voltage in an integrated circuit. The method involves monitoring the voltage on one part of the circuit and adjusting it to ensure that the voltage on another part of the circuit remains stable. This helps to ensure the proper functioning of the integrated circuit and improves its performance.

Problems solved by technology

There are challenges when forming the so-called 3D, such as finFETs, TSVs, etc., as well as for 2D devices.

For example, when a number of die formation are processed on a semiconductor wafer, a voltage drop from one layer of the integrated circuit to another layer can cause performance problems.

This drop, which may be by the amount Vdrop, could cause operation errors and failures.

There are several problems associated with this state of the art solution.

For example, the components of the voltage regulation unit 320 cause an appreciable amount of power loss during its operation.

Further, the voltage regulation unit 320 is not capable of detecting and compensating for voltage drops based on any detection.

This causes increased usage of space, as larger chip packages are required to form the additional die that hosts the voltage regulation unit 320.

Images