Sensor signal transmission from processing system
a processing system and sensor technology, applied in the direction of basic electric elements, semiconductor/solid-state device manufacturing, electric apparatus, etc., can solve the problems of each sensor adding to the complexity and cost of the processing station, the substrate can become misaligned or mispositioned, and the complexity of the processing station can be increased. , to achieve the effect of simple and accura
Inactive Publication Date: 2005-07-21
BEGINSKI DAVID A
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AI Technical Summary
Benefits of technology
[0007] A need therefore exists for a more simple and accurate method fo
Problems solved by technology
There are several general problems that are associated with prior art substrate processing stations.
For example, as the substrate is moved within the processing station, the substrate can become misaligned or mispositioned for various reasons.
Such mispositioning can result in damage to the substrate as it is moved within the processing station and / or our errors in the fabrication process if the mispositioning occurs within a processing module.
Each sensor adds to the complexity and cost of the processing station.
These sensors are also typically difficult to maintain.
In addition, the sensors may require power.
However, the batteries must be periodically replaced, which can be costly and time consuming.
Method used
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[0030]FIG. 1 illustrates an exemplary substrate processing system 10 that comprises two load locks 12, a substrate handling module 14, and two substrate processing modules 16. The substrate handling module 14 comprises a housing 18, which defines a substrate handling chamber 20. The substrate handling chamber 20 is preferably substantially closed and under vacuum. However, in modified embodiments, the substrate handling chamber can be kept a higher pressures (e.g., atmospheric).
[0031] The load locks 12 can be adapted for holding, among other things, a cassette of substrates, a plurality of single substrates and / or a single substrate. The load locks 12 are connected to the substrate handling module 14 by an opening, which is selectively opened and closed by a gate valve 22. In a similar manner, the processing modules 16 are connected to the substrate handling chamber 18 by openings, which are also selectively opened and closed by gate valves 24.
[0032] A substrate handler 26 is posi...
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Abstract
A processing system includes a plurality of chamber walls that define a sealed environment. A sensor is positioned in the sealed environment. In one embodiment, a power source, such as a photoelectric cell, is positioned within the environment. In another embodiment, a wireless transmission device is positioned within the sealed environment. Methods for monitoring the conditions within the sealed environment are also disclosed.
Description
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] This present invention relates to substrate processing and, in particular, to methods and apparatus for conditions within a substrate processing system. [0003] 2. Description of the Related Art [0004] Semiconductor devices, such as transistors, diodes, and integrated circuits, are typically fabricated on a thin slice of semiconductor material, termed a substrate or wafer. The substrate is fabricated within a substrate processing station, which typically includes one or more load locks, a wafer handling module and one or more processing modules. The one or more load locks provide a substantially particle free environment from which substrates may be selectively withdrawn into the substrate handling module. The substrate handling module typically includes a substrate handler, which is configured to move substrates to / from the one or more load locks and to / from the one or more processing modules. [0005] There are sever...
Claims
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CPCH01L21/67259
Inventor BEGINSKI, DAVID A.
Owner BEGINSKI DAVID A