On demand circuit function execution employing optical sensing
a technology of optical sensing and circuit, applied in the direction of optical radiation measurement, semiconductor/solid-state device details, instruments, etc., can solve the problems of inconvenient or possible addition of additional pins at the package, short, or decreased resistance, etc., to achieve the effect of improving the execution of electrical functions
Inactive Publication Date: 2007-06-07
GLOBALFOUNDRIES INC
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AI Technical Summary
Benefits of technology
The present invention relates to improving electrical functions in integrated circuits, such as fusing operations, by using optical sensor technology. The invention allows for the execution of functions through a chip-embedded photodiode that is activated by spectrally selected external light. This activation can be used for yield and reliability purposes without requiring additional pins on the package. The technical effects of the invention include improved functionality and reliability of integrated circuits.
Problems solved by technology
When an antifuse is blown or programmed, this results in a short, or decreased resistance.
In many applications and designs, it is not convenient or possible to have additional pins at the package level for such implementation.
Method used
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Embodiment Construction
[0024] The invention will now be described by reference to the accompanying figures. In these figures, various aspects of the structures have been shown and schematically represented in a simplified manner to more clearly describe and illustrate the invention. For example, the figures are not intended to be to scale. In addition, various aspects of the structures are illustrated as having particular shapes; however, as those skilled in the art will appreciate, the invention is not limited to constructions of any particular shape.
[0025] As mentioned above, this invention generally relates to integrated circuits or semiconductor structures, and FIG. 1 shows a cross-section of the process levels of an integrated circuit 10 associated with executing the functions of the preferred embodiment of this invention. Generally, integrated circuit 10 may include conventional processing levels, with a photodiode N1 formed with N+ impurities in a p-epi region 12 of P+ substrate 14. The following ...
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Disclosed is a method of executing an electrical function, such as a fusing operation, by activation through a chip embedded photodiode through spectrally selected external light activation, and corresponding structure and circuit. The present invention is based on having incident light with specific intensity / wave length characteristics, in conjunction with additional circuit elements to an integrated circuit, perform the implementation of repairs, i.e., replacing failing circuit elements with redundant ones for yield and / or reliability. Also to perform disconnection of ESD protection device from input pad once the packaged chip is placed in system. No additional pins on the package are necessary.
Description
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] This invention generally relates to integrated circuits, and more particularly to executing an electrical function, such as a fusing operation, in an integrated circuit and to a method of manufacture thereof. [0003] 2. Background Art [0004] Fuses and antifuses are programmable electronic devices that are used in a variety of circuit applications. A fuse is normally closed, and when blown or programmed results in an “open” or increase in resistance. An antifuse is similar to a fuse in that it is programmable. However, an antifuse is normally open, having a capacitor-like structure. When an antifuse is blown or programmed, this results in a short, or decreased resistance. [0005] There are many applications for fuses and antifuses. One particular application in integrated circuits is to improve yields using redundancy. By providing, for example, redundant memory cells on memory chips, the circuits or modules that are d...
Claims
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IPC IPC(8): H02H9/00
CPCH01L23/525H01L23/5256H01L27/14609H01L2924/0002H01L2924/00
Inventor ABADEER, WAGDI W.ADKISSON, JAMES W.BROWN, JEFFREY S.CHATTY, KIRAN V.GAUTHIER, ROBERT J. JR.HAUSER, MICHAEL J.RANKIN, JED H.TONTI, WILLIAM R.
Owner GLOBALFOUNDRIES INC