Ruggedized electronics enclosure

a technology of electronics enclosures and enclosures, applied in the direction of cooling/ventilation/heating modifications, printed circuit board receptacles, modifications by conduction heat transfer, etc., can solve the problems of difficult if not impossible upgrade to the latest technology, custom equipment is often significantly more expensive than commercial systems, and cot systems
US20070177348A1Inactive Publication Date: 2007-08-02KEHRET WILLIAM E +1
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
KEHRET WILLIAM E
Publication Date
2007-08-02
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention relates to a ruggedized enclosure for housing and protecting electronic circuits. The enclosure utilizes a top compartment for housing the circuit and a cooling assembly rigidly coupled to the top compartment. The cooling assembly utilizes a passive radiator to form a rigid truss plate structure. The truss plate structure rigidifies the enclosure helping to protect the enclosure and circuit from destructive shock events and destructive vibration events. The cooling assembly further provides an efficient heat exchange for removing heat from the electronic circuit. A method for protecting an electronic circuit utilizing a rigid truss plate structure is also provided.
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Description

RELATED APPLICATION

[0001] This application is a continuation of U.S. patent application Ser. No. 10 / 850,523, entitled “Ruggedized Electronics Enclosure”, that was filed on May 19, 2004, which is a continuation of U.S. patent application Ser. No. 10 / 232,915, entitled “Ruggedized Electronics Enclosure,” that was filed on Aug. 30, 2002.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] This invention is related to enclosures for electronic circuits and particularly to ruggedized enclosures for use in installations subjected to hostile environments including destructive shock events and destructive vibration events. In one embodiment, the invention may operate without requiring additional mechanical isolation.

[0004] 2. Description of the Related Art

[0005] Conventional ruggedized electronics enclosures are often employed in military applications. The environments in which military electronic circuits must be able to operate typically present conditions outside of a co...

Claims

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