Counterflow microchannel cooler for integrated circuits

Abstract

A plurality of channels are formed in a base, e.g., a substrate of an integrated circuit, each channel extending between edges of the base. Two pairs of manifolds are provided, the first pair communicating with a first group of channels and the second pair communicating with a second group of channels, the first group of channels and the first pair of plena isolated from the second group of channels and the second pair of plena. Each of the pairs of manifolds includes multiple branches coupled to the channels and a common plenum. Cooling fluid is injected into the channels from different sides of the base, causing fluid to flow in different directions in the two groups of channels, the channels in thermal contact with the integrated circuit.

Description

BACKGROUND[0001]1. Field of the Invention[0002]This invention relates to cooling integrated circuits and more particularly to microchannel coolers for integrated circuits.[0003]2. Description of the Related Art[0004]Much of the power consumed by a modern integrated circuit (IC) during operation is dissipated as heat, increasing the temperature of the IC and altering its properties. For example, silicon switching speed is slower when hot. Additionally, reliability is reduced as temperature increases. If the temperature is sufficiently high, irreversible damage occurs. To remove heat as quickly as possible, several approaches have been used in the art. These generally involve mounting heat dissipaters, such as heat sinks, near the IC package.[0005]FIG. 1 shows a cross-sectional view of one such prior art integrated circuit assembly 100. An IC 102 is mounted on a substrate 104 using C4 bumps 106. The package lid 108 sits on the substrate 104 and is thermally coupled to the IC 102 by a ...

AI Technical Summary

Benefits of technology

This approach enhances cooling efficiency by ensuring uniform coolant distribution, reducing temperature gradients, and improving the reliability and performance of integrated circuits by effectively managing thermal loads.

Problems solved by technology

Much of the power consumed by a modern integrated circuit (IC) during operation is dissipated as heat, increasing the temperature of the IC and altering its properties.

Additionally, reliability is reduced as temperature increases.

If the temperature is sufficiently high, irreversible damage occurs.

Since many ICs typically have hotspots, i.e., they are not uniformly heated, that non-uniformity may be transferred largely unchanged through the package to the heat exchanger.

A problem with the approach shown in FIG. 2A is that as the cool water enters one side 202 of the semiconductor and travels to the other, it loses cooling capacity by absorbing heat from the semiconductor as it travels.

Thus, some parts of the device are starved of coolant.

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