Inductively coupled integrated circuit with multiple access protocol and methods for use therewith

Abstract

A circuit includes a plurality of integrated circuit dies having a corresponding plurality of circuits and a corresponding plurality of inductive interfaces. A substrate is coupled to support the plurality of integrated circuit dies, the substrate including a magnetic communication path aligned with the plurality of inductive interfaces, to magnetically communicate signals between the plurality of circuits via the plurality of inductive interfaces in accordance with a multi access protocol.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]The present application is related to the following patent applications that are commonly assigned and are concurrently filed herewith:[0002]U.S. application Ser. No. ______, entitled, INDUCTIVELY COUPLED INTEGRATED CIRCUIT AND METHODS FOR USE THEREWITH, filed on ______;[0003]U.S. application Ser. No. ______, entitled, INDUCTIVELY COUPLED INTEGRATED CIRCUIT WITH MAGNETIC COMMUNICATION PATH AND METHODS FOR USE THEREWITH, filed on ______;[0004]U.S. application Ser. No. ______, entitled, INTEGRATED CIRCUIT WITH MILLIMETER WAVE AND INDUCTIVE COUPLING AND METHODS FOR USE THEREWITH, filed on ______; and[0005]U.S. application Ser. No. ______, entitled, INDUCTIVELY COUPLED INTEGRATED CIRCUIT WITH NEAR FIELD COMMUNICATION AND METHODS FOR USE THEREWITH, filed on ______.BACKGROUND OF THE INVENTION[0006]1. Technical Field of the Invention[0007]This invention relates generally to integrated circuits and coupling methods used therein.[0008]2. Descripti...

AI Technical Summary

Problems solved by technology

While this advancement allows for reduction in size of electronic devices, it does present a design challenge of providing and receiving signals, data, clock signals, operational instructions, etc., to and from a plurality of ICs of the device.

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