Phase Change Materials for Applications that Require Fast Switching and High Endurance
a phase change and fast switching technology, applied in the direction of bulk negative resistance effect devices, semiconductor devices, electrical devices, etc., can solve the problems of relatively long time required for reading or writing data from or to flash memory devices, and the general configuration of random access memory devices not generally configured as random access memory devices, etc., to achieve high endurance and high resistivity
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[0052]A phase change composition is prepared by forming a thin film by deposition of said film on silicon wafer substrate through the co-sputtering of germanium and antimony in the presence of a gaseous mixture of argon and nitrogen. The silicon substrate is previously coated with a layer of silicon oxide at a thickness of about one micrometer. The composition of the thin film is determined by means such as Rutherford Back Scattering Analysis. The film contains a solid solution of antimony and germanium. The content of the germanium is about 8% based on atomic ratio. Resistivity as a function of temperature is then measured by forming two contacts on the sample, the contacts having well-defined geometry. The resistivity between these contacts is then measured while heating the sample in a nitrogen atmosphere to prevent oxidation. The resistivity is about 0.01 ohms / cm.
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