Liquid-cooled heat dissipating device and method of making the same
a heat dissipating device and liquid-cooled technology, which is applied in the direction of semiconductor devices, metal-working devices, lighting and heating apparatus, etc., can solve the problems of electronic components attached to the liquid-cooled heat dissipating device b>9/b> being damaged, and the liquid coolant may eventually leakag
Inactive Publication Date: 2010-12-09
TONG HSING ELECTRONICS INDS
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Benefits of technology
[0010]Therefore, the object of the present invention is to provide a liquid-cooled heat dissipating device that can overcome the aforesaid drawbacks of the prior art, and a method of making the same.
Problems solved by technology
Before operating the liquid-cooled heat dissipating device 9, the cover plate 92 and the chamber-confining body 91 must be assembled using the screws 95, thereby causing inconvenience.
The annular seal 96 may go through aging and deformation such that leakage of the liquid coolant may eventually occur.
Thus, the electronic component attached to the liquid-cooled heat dissipating device 9 may be damaged.
Method used
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[0023]Before the present invention is described in greater detail, it should be noted that the same reference numerals have been used to denote like elements throughout the specification.
[0024]Referring to FIGS. 2 and 3, the first preferred embodiment of a liquid-cooled heat dissipating device 101 according to this invention is adapted to lower a temperature of an electronic component (not shown) such as a CPU of a computer. The liquid-cooled heat dissipating device 101 includes a chamber-confining body 22 and a cover plate 23.
[0025]The chamber-confining body 22 confines a liquid chamber suitable for receiving a liquid coolant, and has a surrounding wall 221 that surrounds the liquid chamber, a base plate 21, and a plurality of dividing walls 224. The surrounding wall 221 has a top open end 222 and a bottom open end 223 opposite to the top open end 222, and is formed with a liquid inlet 24 and a liquid outlet 25. Each of the dividing walls 224 has one end connected to an inner wall ...
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Abstract
A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed.
Description
CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority of Taiwanese application no. 098118364, filed on Jun. 3, 2009.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]This invention relates to a liquid-cooled heat dissipating device, more particularly to a liquid-cooled heat dissipating device made by sinter-bonding and to a method of making the same.[0004]2. Description of the Related Art[0005]Referring to FIG. 1, a conventional liquid-cooled heat dissipating device 9 is adapted to be installed on an electronic component (not shown), such as a central processing unit (CPU) of a computer, and to dissipate heat from the same. The liquid-cooled heat dissipating device 9 includes a chamber-confining body 91, a cover plate 92, an inflow tube 93, an outflow tube 94, a plurality of screws 95, and an annular seal 96.[0006]The chamber-confining body 91 has a base wall 911, a surrounding wall 912 that is connected to the base wall 911 and that surrounds a ...
Claims
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Login to View More IPC IPC(8): F28F7/00B21D53/02
CPCF28F3/12F28F21/04F28F21/085H01L23/473Y10T29/4935H01L2924/0002F28F2255/18H01L2924/00
Inventor CHIANG, WEN-CHUNG
Owner TONG HSING ELECTRONICS INDS