Image sensor package structure with large air cavity

Abstract

The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.

Description

BACKGROUND OF THE INVENTION[0001]1. Technical Field[0002]The present invention relates to image sensor package structures. More particularly, the present invention relates to an image sensor package structure with a large air cavity, wherein the image sensor package structure provides an improved image-sensing effect.[0003]2. Description of Related Art[0004]With the ongoing progress of technology, all manufacturers of electronic multimedia devices have made every effort to improve functionality and performance of their products with the attempt to meet all the consumer demands related to audio and / or video entertainments. In such popular electronic multimedia devices, image sensors play a critical role. An image sensor serves to receive and convert optical signals into electrical signals, and transmit the electrical signals to an external device that analyzes the electrical signals. When incorporated in an electronic device, the image sensor enables the electronic device to take sti...

AI Technical Summary

Benefits of technology

[0012]1. By enlarging the air cavity in volume and increasing the distance between the transparent lid and the chip, the improved imaging quality of the image sensor package structure can be achieved.

[0013]2. Since the transparent lid and the plastic sheet are combined by means of injection molding, the manufacturing process can be simplified and the manufacturing cost can be therefore reduced.

[0014]3. By covering the periphery of the upper surface of the transparent lid with the package material, the blockage area from moisture to the chip is extended, thereby ensuring the image-sensing effect of the image sensor package structure against moisture.

Problems solved by technology

Traditionally in downsizing an image sensor, it is the general approach to adhere the transparent lid right on top of the image sensor chip, resulting in a very short distance between the transparent lid and the image sensor chip.

As a result, when light passes through the transparent lid and enters into the sensitization area of the image sensor chip, the multi-refraction or multi-reflection of light is likely to occur, leading to poor imaging quality as well as ghost images.

Images