Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for determining planting ball number of camera module

a technology of camera modules and planting balls, which is applied in the field of determining the planting ball number of camera modules, can solve the problems of unnecessary packaging cost increase and chip skew, and achieve the effect of enhancing the quality of packaging camera modules

Inactive Publication Date: 2013-01-17
PRIMAX ELECTRONICS LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is about a way to figure out the size of a camera module used in a package. This helps improve the quality of packaging the camera module.

Problems solved by technology

For example, if the same number of conductive bumps 13 are placed on all of the connection regions 122, unnecessary packaging cost is increased.
In addition, the uneven heights of the contact pads 111 may result in skew of the chip 12.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for determining planting ball number of camera module
  • Method for determining planting ball number of camera module
  • Method for determining planting ball number of camera module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021]FIG. 3 schematically illustrates a camera module according to an embodiment of the present invention. As shown in FIG. 3, the camera module 20 comprises a substrate 21 and a chip 22. The substrate 21 has an opening 211 and a plurality of contact pads Pn, wherein n=1˜n, and n is a positive integer. The opening 211 has four rims 211a, 211b, 211c and 211d. Each of the contact pads Pn is used for supporting at least one conductive bump. For example, the conductive bump is a planting ball 23, which is made of conductive metallic material. Through the planting ball 23, the substrate 21 and the chip 22 are electrically connected with each other and combined together. The planting ball 23 has a ball high h.

[0022]A method for determining the planting ball number of the camera module will be illustrated in more details as follows.

[0023]Please refer to FIG. 4, which schematically illustrates a machine for determining the planting ball number. As shown in FIG. 4, the machine 30 comprises ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for determining the planting ball number of a camera module is provided. The camera module includes a substrate and a chip. The substrate includes an opening and a plurality of contact pads. The opening of the substrate has four rims. The method includes the following steps. Firstly, an image pickup device is used to detect an average contact pad distance of the distances from four specified contact pads of the substrate to the image pickup device. Then, a smallest opening distance among four opening distances from the four rims to the image pickup device is acquired. Then, plural actual contact pad distances from all contact pads to the image pickup device are acquired. The planting ball number for each contact pad is calculated according to these distances. Consequently, the quality of assembling the camera module is enhanced.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a method for determining the planting ball number, and more particularly to a method for determining the planting ball number of a camera module.BACKGROUND OF THE INVENTION[0002]FIG. 1 schematically illustrates a conventional camera module. As shown in FIG. 1, the camera module 10 is assembled by a flip-chip packaging technology. The camera module 10 comprises a substrate 11 and a chip 12. The substrate 11 has a contact pad 111 and an opening 112. The chip 12 has a sensing region 121 and a connection region 122. A conductive bump 13 is disposed on the connection region 122. Through the conductive bump 13, the contact pad 111 and the connection region 122 are electrically connected with each other, and the substrate 11 and the chip 12 are combined together.[0003]Please refer to FIG. 1 again. The contact pad 111 is disposed around the opening 112 and aligned with the connection region 122. The opening 112 is formed by using ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01C5/00
CPCH04N5/2257G01C5/00H04N23/57
Inventor LYU, SZU-HAOYU, CHIEN-NAN
Owner PRIMAX ELECTRONICS LTD