Heat Dissipating Device

Inactive Publication Date: 2013-11-07
MICROTIPS ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006]The object of the present invention is to provide a heat dissipatin

Problems solved by technology

However, since the above-mentioned heat dissipating device 1 can only enable the coolant 100 to flow horizontally due to the lack of space for

Method used

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Examples

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Example

[0019]Referring to FIG. 3, a heat dissipating device 2 according to the first preferred embodiment of this invention includes a heat conducting unit 3 and a coolant storing unit 4 for storing a coolant and in fluid connection with the heat conducting unit 3. The coolant storing unit 4 includes two modules 41 in fluid connection with each other. Each module 41 includes a first coolant storage member 411, a second coolant storage member 412, a plurality of conduit members 413 fluidly connecting the first coolant storage member 411 and the second coolant storage member 412, and a plurality of heat dissipating fins 414 connected between adjacent pairs of the conduit members 413. The first coolant storage members 411 of the two modules 41 are disposed side by side with each other. A distance between the second coolant storage members 412 of the two modules 41 is greater than a distance between the first coolant storage members 411 of the two modules 41. In this preferred embodiment, the ...

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Abstract

A heat dissipating device includes a heat conducting member and a coolant storing unit. The heat conducting member includes a surrounding wall that defines an internal space and that is adapted to be placed in contact with a heat source, and a plurality of heat conducting plates that are spacedly disposed in the internal space, that are connected to the surrounding wall, and that cooperate with the surrounding wall to define a plurality of flow channels. The coolant storing unit stores a coolant and is in fluid connection with the heat conducting member. The flow channels extend upwardly, and the coolant flows along the flow channels when the heat of the heat source is transmitted to the coolant.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority of Taiwanese application no. 101115573, filed on May 2, 2012.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a heat dissipating device.[0004]2. Description of the Related Art[0005]Referring to FIG. 1, a heat dissipating device 1 according to R.O.C. patent no. M261972 is shown to include a base 10 and a heat dissipating unit 11 disposed on the base 10. As illustrated in FIG. 2, the base 10 has a plurality of channels 101 intersecting each other for coolant 100 to flow horizontally therewithin. When in use, a heat source (not shown) is placed in contact with the base 10. The coolant 100 absorbs the heat produced by the heat source, and the heat is dissipated by the heat dissipating unit 11. Normally, the coolant 100 is converted between gaseous and liquid states for heat dissipation and coolant circulation of itself. However, since the above-mentioned heat diss...

Claims

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Application Information

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IPC IPC(8): F28F3/00
CPCF28F3/00F28D15/0266H01L23/473H01L2924/0002H01L2924/00
Inventor OMORI, TAKESHILIN, HSIN-HUNG
Owner MICROTIPS ELECTRONICS
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