Loop thermosyphon cooling device

Abstract

A loop thermosyphon cooling device includes an evaporator, a condenser and a communication assembly. The evaporator includes a heat conducting element and evaporation pipes, and the heat conducting element has through holes, and each evaporation pipe is passed and positioned into each respective through hole. The condenser includes a condensation pipe. The communication assembly includes a first barrel and a second barrel, and both ends of each evaporation pipe are communicated with the first and second barrels, and both ends of the condensation pipe are communicated with the first and second barrels, so that the evaporation pipe, condensation pipe, first barrel and second barrel jointly define a loop. A communication assembly is coupled between the evaporation pipe and the condensation pipe, and the quantity of evaporation pipes and condensation pipes can be increased or decreased as needed, and the thermosyphon cooling device is compact and high heat dissipation efficiency.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a cooling device, and more particularly to the loop thermosyphon cooling device.BACKGROUND OF THE INVENTION[0002]Cooling devices are used extensively in different places such as playgrounds, malls and factories where high bay lamps are installed and used as a main light source, and the light source of the high bay lamp is gradually replaced by low power consuming LEDs. However, LEDs will generate a large amount of heat, so that it is necessary to add a cooling device at the high bay lamp to assist the effect of dissipating the heat generated by the LEDs. In addition, places such as machine rooms having equipment like mainframe computers, servers or instruments installed therein may accumulate lots of heat after a long time of the operation, so that the cooling device is required to prevent the equipment from being damaged and achieve the heat dissipation effect.[0003]A conventional “loop cooling device” as disclosed in Tai...

AI Technical Summary

Benefits of technology

The present invention is about a cooling device that uses a loop thermosyphon. The invention has a communication assembly that can connect or disconnect the evaporation and condensation pipes as needed. This allows for an increase or decrease in the number of pipes as required, which provides both benefits of a small size and high heat dissipation efficiency.

Problems solved by technology

However, LEDs will generate a large amount of heat, so that it is necessary to add a cooling device at the high bay lamp to assist the effect of dissipating the heat generated by the LEDs.

In addition, places such as machine rooms having equipment like mainframe computers, servers or instruments installed therein may accumulate lots of heat after a long time of the operation, so that the cooling device is required to prevent the equipment from being damaged and achieve the heat dissipation effect.

However, the aforementioned loop cooling device has the following drawbacks: more loop heat pipes are generally required in the evaporation area and the condensation area for dissipating heat; and the loop heat pipe can be used only for guiding the flow in areas other than the evaporation area and the condensation area, so that less loop heat pipes are required in areas other than the evaporation area and the condensation area to reduce the total volume of the cooling device, but the loop heat pipe is a single pipe, and the quantity of loop heat pipes in each area is the same, and the loop cooling device cannot have both advantages of small volume and high heat dissipation efficiency.

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