Printed circuit board and method of manufacturing the same
a technology of printed circuit board and printed circuit board, which is applied in the direction of printed circuit stress/warp reduction, laminated printed circuit board, printed element electric connection formation, etc., can solve the problems of high density circuit and inhibit a number of build-up layers of printed circuit board
Inactive Publication Date: 2016-12-29
SAMSUNG ELECTRO MECHANICS CO LTD
View PDF9 Cites 17 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
This patent describes a printed circuit board with a core layer that includes a core stiffener layer, two metal layers, and a photo imagable dielectric layer. The board also includes a through via and an inner circuit layer. The technical effects of this design include improved heat dissipation, reduced thickness, and improved circuit performance. The method of manufacturing the printed circuit board involves preparing the core layer, laminating a photo imagable dielectric layer, and using a semi-additive plating method to form the inner circuit layer and through via. The printed circuit board may also include a solder resist and prepreg layers.
Problems solved by technology
Further, because the circuit is formed using a subtractive process for the inner core described above, a high density circuit cannot be realized, thus, inhibiting a number of build-up layers for the printed circuit board.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0057]The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatuses, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and / or systems described herein will be apparent to one of ordinary skill in the art. The sequences of operations described herein are merely examples, and are not limited to those set forth herein, but may be changed as will be apparent to one of ordinary skill in the art, with the exception of operations necessarily occurring in a certain order. Also, descriptions of functions and constructions that are well known to one of ordinary skill in the art may be omitted for increased clarity and conciseness.
[0058]The features described herein may be embodied in different forms, and are not to be construed as being limited to the examples described herein. Rather, the examples described herein have been provided so that this disc...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
A printed circuit board in accordance with an embodiment includes a core layer, a photo imagable dielectric layer, and an inner circuit layer. The core layer includes a core stiffener layer, a first metal layer formed on an upper surface of the core stiffener layer, and a second metal layer formed on a lower surface of the core stiffener layer. The photo imagable dielectric layer is formed on an upper surface and a lower surface of the core layer. The inner circuit layer is formed on the photo imagable dielectric layer.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit under 35 USC 119(a) of Korean Patent Application No. 10-2015-0092321, filed with the Korean Intellectual Property Office on Jun. 29, 2015, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND[0002]1. Field[0003]The following description relates to a printed circuit board and a method of manufacturing a printed circuit board.[0004]2. Description of Related Art[0005]Owing to rapid technological advancement, electronic devices have recently become increasingly high-functional. At the same time, electronic components have become lighter, thinner, and smaller. Also, printed circuit boards are required to have multiple functions, more density, and slimmer size.[0006]For the conventional main boards used for mobile devices, an inner circuit is formed on a copper clad laminate (CCL) through circuit forming processes. A copper foil and a prepreg, which is a thermosetting insulat...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(United States)
IPC IPC(8): H05K1/02H05K3/46H05K3/40H05K1/11H05K3/00
CPCH05K1/0298H05K1/115H05K1/0212H05K2201/09827H05K3/4038H05K3/4661H05K3/0058H05K3/4608H05K2201/2009H05K1/0206H05K1/0271H05K1/053H05K3/429H05K3/4688H05K2201/096
Inventor MOK, JEE-SOOKO, YOUNG-GWANPARK, JUNG-HYUNLEE, JAE-EANKO, YOUNG KUKKIM, GOING-SIK
Owner SAMSUNG ELECTRO MECHANICS CO LTD