Copper-iron alloy electroplating solution and electroplating method using the same

Abstract

Provided are a copper-iron alloy electroplating solution containing divalent copper ions, trivalent iron ions, and an organic compound having a carboxy group, and a technique for producing a copper-iron alloy through a method other than a melting method by an electroplating method using the copper-iron alloy electroplating solution.

Description

BACKGROUND OF THE INVENTIONField of the Invention[0001]The present invention relates to a copper-iron alloy electroplating solution and an electroplating method using the same.Background Art[0002]A copper-iron alloy has properties of both copper and iron, and therefore is expected to be used for a structural material, a thermally conductive material, a magnetic material, an electrically conductive spring raw material, an electrically conductive material, etc.[0003]However, copper and iron have different specific gravities, and therefore, it is difficult to uniformly alloy these together, and a melting method is known as a technique for producing a copper-iron alloy for the time being (for example, JP-A-2016-216758). However, a copper-iron alloy produced by a melting method has difficulty in processing, and use thereof is limited.SUMMARY OF THE INVENTION[0004]In view of this, an object of the present invention is to provide a technique for producing a copper-iron alloy by a method ot...

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Benefits of technology

[0005]The present inventors made intensive studies for achieving the above object, and as a result, they found that a copper-iron alloy can be electrop

Problems solved by technology

However, copper and iron have different specific gravities, and therefore, it is difficult to uniformly alloy these together, and a melting method is known as a technique for producing

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