System and method of guiding real-time inspection using 3D scanners
a real-time inspection and scanner technology, applied in the direction of instruments, measurement devices, computing, etc., can solve the problems of inaccurate scanning of inspection elements required for measurement, and the inability to perform accurate inspection that the designer intended, so as to achieve accurate measurement of inspection elements
Active Publication Date: 2009-01-06
INUS TECH
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- Description
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AI Technical Summary
Benefits of technology
Enables operators to accurately measure objects according to designers' intentions, reducing errors and improving inspection efficiency by providing guided measurement processes and validation of measurement data.
Problems solved by technology
On the contrary, in the case where an operator is unskilled and the performance of the 3D scanner is unfavorable, inspection elements required for measurement are not accurately scanned.
Also, in the case where a designer who has designed an object to be measured cannot accurately deliver inspection elements (e.g., the shape of an object, the dimensions of a measured object, and an allowable tolerance) to an operator manipulating the 3D scanner, the accurate inspection that the designer intended cannot be performed properly.
Method used
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Embodiment Construction
[0033]Reference will now be made in detail to a preferred embodiment of the present invention.
[0034]FIG. 1 is a block diagram of a system of guiding a real-time inspection using a 3D scanner according to the present invention, FIG. 2 is an exemplary view of a measurement process using the system of guiding a real-time inspection using the 3D scanner of FIG. 1, and FIG. 3 is another exemplary view of a measurement process using the system of guiding a real-time inspection using the 3D scanner of FIG. 1.
[0035]The system of guiding a real-time inspection using a 3D scanner according to the present invention will be described with reference to FIGS. 1 through 3.
[0036]The system includes a 3D scanner (100) for scanning an object to be measured; a data storage unit (300) for storing shape information, inspection information, and inspection guide information of the object; a display unit (400) for outputting measurement information detected from the 3D scanner 100 and the inspection guide ...
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A system and a method of guiding a real-time inspection using a 3D scanner are provided. The system and the method of guiding a real-time inspection using a 3D scanner allow an operator to perform an accurate and swift inspection of an object to be measured so as to meet a designer's design intentions. For that purpose, 3D shape information of an object to be measured is detected using a scanner and shape information and inspection guide information of the object stored in a data storage unit, and inspection information of the object for judging the validity of the measurement information detected from the scanner is checked through a display unit. After that, the scanner is operated to compare the measurement information detected by the scanner with the inspection information so as to judge the validity of the measurement. Therefore, an operator can accurately understand a designer's intentions for inspection to perform measurement.
Description
BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a system and a method of guiding a real-time inspection using a 3-dimensional (3D) scanner, and more particularly, to a system and a method of guiding a real-time inspection using a 3D scanner so that an operator may perform an accurate and swift inspection of an object to be measured in accordance with the designer's design intentions.[0003]2. Description of the Related Art[0004]Measurement using a 3D scanner can obtain shape information of an object by digitally processing an image obtained by simply photographing the object using imaging equipment without directly contacting the object to be measured.[0005]The measurement using a 3D scanner is used for obtaining shape information of an object that is easily damaged when external force is applied to the object to be measured or a high-precision, small-sized component, as in the cases of manufacturing a semiconductor wafer, measuring a ...
Claims
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IPC IPC(8): G01B11/24
CPCG01B11/24G06V10/10
Inventor BAE, SEOCK HOONKIM, TAE JOO
Owner INUS TECH