Multilayer wiring substrate having a castellation structure

a castellation structure and wiring substrate technology, applied in the direction of electrical equipment, semiconductor devices, semiconductor/solid-state device details, etc., can solve the problems of high disposal cost, limited structure above, manufacturing location, etc., and achieve the effect of small and thin structure and improved connection strength of sensor components

Active Publication Date: 2013-01-01
SONY CORP
View PDF25 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]However, the above-mentioned structure is limited to a stack-up manufacturing process in which the integrated circuit 4 is joined after the cavity 3 is formed by the first substrate 1 and the second substrate 2. This has the following disadvantages.
[0013]It is desirable to provide a multilayer wiring substrate, a stack structure sensor package, and a method of manufacturing the stack structure sensor package that enable a sensor component to be reused even when a failure occurs during manufacture, improve connection strength of the sensor component, and make the structure small and thin.
[0017]According to the embodiments of the present invention, it is possible to reuse a sensor component even when a failure occurs during manufacture of a sensor package having a stack structure, to improve connection strength of the sensor component, and to make the structure small and thin.

Problems solved by technology

However, the above-mentioned structure is limited to a stack-up manufacturing process in which the integrated circuit 4 is joined after the cavity 3 is formed by the first substrate 1 and the second substrate 2.
Since the stack-up in the same process step is necessary, a manufacturing location is limited.
Besides, occurrence of a failure causes a high disposal cost.
However, there may be a problem with connection strength because a joint area is limited to the bottom surface.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030]The following describes embodiments of the present invention with reference to the drawings in the following order.[0031]1. Embodiment[0032]2. Another embodiment

[0033]FIG. 2 illustrates a structure example of a stack structure sensor package to which a multilayer wiring substrate is applied according to an embodiment of the present invention.

[0034]A sensor package 10 has a stack structure that basically includes a multilayer wiring substrate 11, an image sensor chip 12, a frame 13 formed of ceramic, a resin, or the like, and an optical filter 14 as main components.

[0035]The multilayer wiring substrate 11 is a substrate that serves as a base of the stack structure sensor package 10 of an image sensor, and has the following characteristic structure.

[0036]A through hole 113 that passes from a first surface (front surface) 111 through to a second surface (back surface) 112 is formed in a center portion of the multilayer wiring substrate 11.

[0037]In the multilayer wiring substrate ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A multilayer wiring substrate has a through hole that passes from a first surface through to a second surface. The multilayer wiring substrate includes an electrical connection terminal formed in at least one of an inner edge portion which is a periphery of the through hole, an outer edge portion which is an outer periphery of the substrate, and a non-edge portion, on at least one of the first surface and the second surface. The electrical connection terminal has a castellation structure that does not pass through to a surface opposite to a formation surface.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a multilayer wiring substrate, a stack structure sensor package, and a method of manufacturing the stack structure sensor package that are applied to an image sensor and the like.[0003]2. Description of the Related Art[0004]Japanese Unexamined Patent Application Publication No. 2002-353427 proposes a stack structure sensor package of an image sensor.[0005]FIG. 1 illustrates the stack structure sensor package of the image sensor as disclosed in Japanese Unexamined Patent Application Publication No. 2002-353427.[0006]In a sensor package structure in FIG. 1, a frame-shaped second substrate 2 is joined onto a first surface of a first substrate 1, thereby forming a cavity 3.[0007]An integrated circuit 4 is mounted on the first surface of the first substrate 1 in the cavity 3, and an image sensor chip 5 is joined onto the second substrate 2. Thus, the stack structure sensor package is formed.S...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(United States)
IPC IPC(8): H01L23/053H01L23/12H01L27/15H01L29/267H01L31/12H01L33/00H01L29/73H01L29/74H01L31/111H01L31/0203H01L31/00H01L29/40
Inventor SHIBUTA, NORIKOTERASAKI, TOHRUYAMADA, TOMOYASUNAITO, NOBUOTSUKUDA, YUKIHIKONONOYAMA, RYU
Owner SONY CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products