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Low profile computer case and computer

a computer and low-profile technology, applied in the field of low-profile computer cases and computers, can solve the problems of increasing power density, heat generation, and limiting heat dissipation, so as to minimize the footprint of a cooling device, maximize the volume of airflow, and maximize the component space

Inactive Publication Date: 2009-01-27
TECH ADVANCEMENT GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014]It is another object of the invention to maximize the volume of airflow in a computer case.
[0015]It is another object of the invention to minimize the footprint of a cooling device in a computer case.

Problems solved by technology

However, such an increase in power density runs into a limitation of heat dissipation.
More specifically, the higher the power density, the more heat generated and the more difficult it is to dissipate the heat.
Of course, heat adversely affects the operation of most microprocessor based components and other computer components.
Accordingly, the use of a fan in the front or back panel wastes precious panel space.
Accordingly, side panels of the racks may interfere with operation of fans mounted in side panels of computer cases and thus the practice of mounting fans in side panels of computer cases has limited application.
Such rails interfere with fans mounted in side panels.
If one of the fans fails, air tends to re-circulate back through the opening in which the failed fan is mounted and thus a complex louver arrangement is provided.
The use of two centrifugal fans having intake ports opposite devices requires a large amount of space in the chassis and thus the arrangement disclosed in U.S. Pat. No. 5,168,424 is not suitable for a low profile computer chassis which includes a motherboard and other components that require additional space in the chassis.
Accordingly, case size and cooling considerations have limited the number of components, such as various media drives, that can be housed in a 2U case.
Accordingly, the functionality and flexibility of conventional computers and computer components in 2U cases is limited.
Therefore, the use of rails, further limits the effective width of a case.
Finally, an increased number of components results in an increased number of communication and power cables.
If the cables are too bulky and not managed properly, they further restrict air flow and thus cooling.

Method used

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  • Low profile computer case and computer
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Embodiment Construction

[0026]FIGS. 1-5 illustrate a preferred embodiment of the invention. Computer 10 includes case 20 component bays 30, 32, and 34, mother board 36, and power supply 38. Case 20 of the preferred embodiment is a standard 19″ rack mount, 24″ deep, 2U case. In other words, case 20 defines a rectangular enclosure that is dimensioned to fit into a standard EIA-310-C 2U space in a 19″ rack. As illustrated in FIGS. 1 and 2, case 20 is constructed of front panel 22, side panels 24, back panel 26 bottom panel 27, and top panel 28. It should be noted that the location of these various panels are only described so as to more clearly explain the present invention in regards to the orientation of the case 20 as shown in the illustrated example of FIGS. 1-5. More generally, as can be seen from these figures, the rectangular enclosure is defined by a plurality of panel pairs, each panel pair comprising two panels positioned opposing one another. For instance, the front panel 22 and the back panel 26 c...

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PUM

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Abstract

A low profile computer case having two centrifugal blowers mounted in a partition therein. An intake port of a first blower faces a bottom panel of the case and an intake port of the second blower faces a top panel of the case. Standoff dimensions are defined between the respective intake ports and panels to permit operation of the blowers.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The invention relates to computer cases and computers and more specifically, the invention relates to a low profile computer case and computer.[0003]2. Description of the Related Art[0004]As computers become more ubiquitous in society, it becomes more desirable to reduce the size of computer systems. Currently, there is a clear trend toward more powerful and more compact computer systems. Accordingly, the consumed power per unit density, i.e. the power density, of the average computer has increased tremendously over the past several years. However, such an increase in power density runs into a limitation of heat dissipation. More specifically, the higher the power density, the more heat generated and the more difficult it is to dissipate the heat. Of course, heat adversely affects the operation of most microprocessor based components and other computer components. Accordingly, the desire to reduce the size and increase ...

Claims

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Application Information

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IPC IPC(8): H05K7/20G06F1/20
CPCG06F1/203H05K7/20727
Inventor MCEWAN, JOHN A.MCEWAN, JAMES STEWART
Owner TECH ADVANCEMENT GROUP