Low profile computer case and computer
a computer and low-profile technology, applied in the field of low-profile computer cases and computers, can solve the problems of increasing power density, heat generation, and limiting heat dissipation, so as to minimize the footprint of a cooling device, maximize the volume of airflow, and maximize the component space
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[0026]FIGS. 1-5 illustrate a preferred embodiment of the invention. Computer 10 includes case 20 component bays 30, 32, and 34, mother board 36, and power supply 38. Case 20 of the preferred embodiment is a standard 19″ rack mount, 24″ deep, 2U case. In other words, case 20 defines a rectangular enclosure that is dimensioned to fit into a standard EIA-310-C 2U space in a 19″ rack. As illustrated in FIGS. 1 and 2, case 20 is constructed of front panel 22, side panels 24, back panel 26 bottom panel 27, and top panel 28. It should be noted that the location of these various panels are only described so as to more clearly explain the present invention in regards to the orientation of the case 20 as shown in the illustrated example of FIGS. 1-5. More generally, as can be seen from these figures, the rectangular enclosure is defined by a plurality of panel pairs, each panel pair comprising two panels positioned opposing one another. For instance, the front panel 22 and the back panel 26 c...
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