The present invention provides a
solder ball separation device, including a hopper for storing solder balls, a
machine platform for supporting the hopper, a cover body covering the hopper, and a
material transfer mechanism for removing solder balls from the hopper, wherein the hopper is located in the cover body, and the cover body is provided with a material taking port for a suction head of a
manipulator to extend into the cover body; the
material transfer mechanism includes a
material transfer column arranged in the hopper and a first
linear drive mechanism for driving the material transfer column to transfer the solder balls to the material taking port position for the suction head to absorb, the first
linear drive mechanism is arranged on the
machine platform, and the material transfer column is connected to the first
linear drive mechanism. When in use, the first linear drive mechanism drives the material transfer column to transfer the solder balls in the hopper to the material taking port position on the cover body, so that the solder balls in the hopper can be automatically separated quickly and efficiently, and there will be no ball jamming. The
solder ball separation efficiency is high, and it can also be applicable to the separation of solder balls of different sizes, without the need to configure a variety of different
solder ball separation devices for solder balls of different sizes.