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2results about How to "Reduce airflow" patented technology

A pre-warning device

ActiveCN224399936Ureduce airflowTimely reminder to take measuresFire alarmsThermometer applicationsFire riskStructural engineering
The utility model belongs to the technical field of alarm device, disclose a kind of early warning device, the early warning device includes export piece and early warning mechanism, export piece inner wall is fixedly connected with fan, early warning mechanism includes early warning prompt subassembly and early warning trigger subassembly, early warning prompt subassembly includes heat pipe and connector, heat pipe is installed in export piece far from the one end of fan, connector is set on heat pipe, connector inside is equipped with plugging block, plugging block has solidification state and melting state, plugging block is in solidification state, plugging block can block connector to make connector and heat pipe disconnect;Plugging block is in melting state, plugging block can be separated from connector to make connector and heat pipe communicate;Early warning trigger subassembly can selectively communicate or disconnect with heat pipe, early warning trigger subassembly disconnects with heat pipe, and early warning trigger subassembly can send early warning signal.The early warning device provided by the utility model can effectively identify fire risk and improve early warning effect.
Owner:CHINA TOBACCO GUANGXI IND

Packaging structure and electronic devices

ActiveCN224290062Ureduce airflowReduce the risk of membrane ruptureElectrostatic transducer microphonesAcousticsMechanical engineering
This application discloses a packaging structure and an electronic device. The packaging structure includes a substrate and a MEMS chip. The substrate has opposing first and second surfaces, with first and second acoustic holes respectively disposed on the first and second surfaces. An airflow channel connecting the first and second acoustic holes is disposed inside the substrate. The projection of the airflow channel onto the first surface extends beyond the outer edge of the first acoustic hole, and / or the projection of the airflow channel onto the second surface extends beyond the outer edge of the second acoustic hole. The MEMS chip is disposed on the first surface of the substrate, and the diaphragm of the MEMS chip is opposite to the first acoustic hole.
Owner:GOERTEK MICROELECTRONICS CO LTD

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