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Chip grinding stage

A technology for grinding machines and wafers, which is applied in the direction of grinding machine tools, grinding devices, grinding/polishing equipment, etc., can solve the problems of scrapping wafers 16, increasing the cost of the manufacturing process, and reducing the qualified rate of the manufacturing process, so as to reduce the impact force, Avoid the effect of cross cracks

Inactive Publication Date: 2007-11-28
POWERCHIP SEMICON CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the crystal backgrinding process usually produces a large amount of contamination particles 18 (for example: silicon powder), which adhere to the wafer 16 and the upper surface 12a and the lower surface 12b of the wafer suction pad 12
As shown in Figures 1 and 2, since the surface of the wafer 16 after grinding is attached with contamination particles 18 and has a thinner thickness, and because the wafer suction pad 12 has a lower surface 12b with a high hardness and a large area, when the wafer When the suction pad 12 utilizes vacuum suction to pick up the wafer 16, it is easy to produce a cross crack 20 on the wafer 16, thus causing the wafer 16 to be scrapped.
However, before the crystal back grinding process, various integrated circuits and metal interconnects have been fabricated on the wafer 16, so scrapping the wafer 16 not only reduces the pass rate of the manufacturing process, but also greatly increases the cost of the manufacturing process

Method used

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  • Chip grinding stage
  • Chip grinding stage
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Embodiment Construction

[0015] Please refer to FIG. 3 to FIG. 6 . FIG. 3 to FIG. 6 are schematic diagrams of a wafer grinder platform according to a preferred embodiment of the present invention. As shown in Figure 3, the wafer grinder platform 30 of the present invention includes a housing 32, two crystal boat placement seats 34a and 34b for placing a plurality of wafers 36, and a positioning platform 40 for adjusting each wafer 36 The orientation, a rotating platform 42, used to clean the wafer 36 after grinding, and a mechanical arm 38, used to transfer the wafer 36 from the crystal boat placement seat 34a to the positioning platform 40 or transfer the wafer 36 from the rotating platform 42 To the crystal boat placement seat 34b. In addition, the wafer grinding machine 30 further includes two thickness measuring units 46a and 46b for measuring the thickness of the wafer 36, and two grinding devices 48 and 58 for grinding the back side of the wafer 36 to reduce the thickness of the wafer 36. , whe...

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Abstract

The chip grinding stage includes one chip conveyer for conveying chip, and the first and the second nozzles for cleaning the chip conveyer. The chip conveyer has at least one chip sucking pad and one conveying mechanism connected to the chip sucking pad. The chip sucking pad includes one soft surface for adsorbing chip to avoid crossed crack produced in the chip.

Description

technical field [0001] The invention relates to a wafer grinding apparatus, in particular to a wafer backside grinding apparatus which can avoid cross cracks in the wafer. Background technique [0002] The crystal back grinding machine is mainly used to grind the back of the semiconductor wafer to effectively control the thickness of the semiconductor wafer, thereby facilitating the subsequent packaging and manufacturing process. Generally speaking, the crystal back grinding machine includes bases such as a positioning platform, a grinding platform, and a rotating platform, and the semiconductor wafers are sequentially positioned, ground, and cleaned on various bases. In addition, the crystal back grinding machine also includes a wafer transfer device, so that the semiconductor wafer can be moved between various bases. Since the semiconductor wafer and the wafer transfer device are in frequent contact, the design of the wafer transfer device is a very important issue in ord...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/04B24B55/00H01L21/304
Inventor 吴牧融钟明晏
Owner POWERCHIP SEMICON CORP