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Memory card packaging method and structure

A packaging method and memory card technology, which is applied in the field of memory cards, can solve problems such as small gaps at joints, short service life, and cracks at joints

Inactive Publication Date: 2009-03-11
刘钦栋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its disadvantage is that when the electronic product is extracted many times for a long time, it is easy to break and damage the joint, or the joint is easy to produce a very small gap, causing moisture to penetrate into the internal circuit board, so the service life is not long

Method used

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  • Memory card packaging method and structure
  • Memory card packaging method and structure
  • Memory card packaging method and structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] like figure 1 Shown is the flowchart of the memory card encapsulation method of the present invention, and its steps are:

[0028] Step 11, placing the circuit substrate in a base case, and exposing the electrical contacts of the circuit substrate;

[0029] Step 12, disposing a pressing plate on the top of the base case, although the pressing plate covers most of the circuit substrate, the electrical contacts of the circuit substrate are still exposed; and

[0030] Step 13, forming a cladding layer around the base shell and the pressure plate by injection molding, the setting area of ​​the cladding layer includes: the junction between the base shell and the pressure plate, and the electrical contacts around the circuit board and the base shell and The joint of the pressure plate. The raw material can be fused together with the previous base shell and the pressing plate during the forming and hardening process to form a completely sealed structure, only the electrical ...

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Abstract

A method for packaging memory card includes setting a circuit base plate on base shell, covering a pressing plate at top to base shell, forming a cladding layer at periphery of base shell and pressing plate by jet-forming for finalizing complete memory card and for sealing joint position of each component to make memory card have excellent waterproof ability.

Description

technical field [0001] The invention relates to memory card technology, in particular to a design for good packaging of the memory card by means of injection molding. Background technique [0002] With the continuous innovation of digital products such as digital cameras, mobile phones, personal digital assistants, and audio-visual players, the product technology is becoming more and more mature, making consumers' demand for flash memory cards only increase. At present, the common flash memory card products on the market are mainly divided into Compact Flash (CF) Card, Smart Media Card (SMC Card), Multi Media Card (MMC) and Secure Digital (SD) Card , Memory Stick (MS) Card (MS card), etc. In addition, xD-Picture card is a new type of memory card. As the memory capacity of the memory card continues to increase, the amount of data that can be accessed has also increased several times. Correspondingly, once it is broken and damaged, it also means that many precious data of th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077H01L21/56
Inventor 刘钦栋
Owner 刘钦栋