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Multilayer structure forming method, method of manufacturing wiring board, and method for manufacturing electronic apparatus

A manufacturing method and technology of electronic instruments, applied in the direction of cable/conductor manufacturing, semiconductor/solid device manufacturing, and improvement of metal adhesion of insulating substrates, etc., can solve the problem of small area of ​​extended wetting

Active Publication Date: 2009-04-01
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, after the liquid-like material bomb falls on the surface of the object, the area wetted by expansion is very small.
Such a liquid material is suitable for forming the insulating part of the through hole in the insulating layer, but it is difficult to form the part far away from the through hole.

Method used

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  • Multilayer structure forming method, method of manufacturing wiring board, and method for manufacturing electronic apparatus
  • Multilayer structure forming method, method of manufacturing wiring board, and method for manufacturing electronic apparatus
  • Multilayer structure forming method, method of manufacturing wiring board, and method for manufacturing electronic apparatus

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Experimental program
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Embodiment approach 1

[0059] (A. The overall structure of the droplet ejection device)

[0060]The method for forming a multilayer structure according to this embodiment uses the droplet ejection devices 1 to 6 shown in FIG. 1 . The droplet discharge devices 1 to 6 are devices for discharging the insulating material 7A ( FIG. 1 ), the conductive material 8A, the insulating material 9A, the insulating material 11A, the conductive material 15A, and the insulating material 17A. Furthermore, as described below, the insulating material 7A, the conductive material 8A, the insulating material 9A, the insulating material 11A, the conductive material 15A, and the insulating material 17A are all types of liquid materials.

[0061] The droplet discharge device 1 shown in FIG. 1 is basically an inkjet device. More specifically, the droplet ejection device 1 is equipped with: a container 101 for holding a liquid material 111, a pipe 110, a base GS, a nozzle head 103, a table 106, a first position control devic...

Embodiment approach 2

[0132] The method of forming the multilayer structure of the present embodiment is the same as the method of forming the multilayer structure of the first embodiment except for the method of forming the insulating pattern 11 . For this reason, descriptions of the same steps and configurations as those in Embodiment 1 are omitted to avoid duplication.

[0133] First, as described in Embodiment 1, the insulating patterns 9 ( Image 6 (a) to (c)). Then, light is irradiated to the base region 20 to make the surface of the insulating layer 7 lyophilic ( Image 6 (d)). The ejection step for forming the insulating pattern is carried out as follows, as is generally performed on a flat surface.

[0134] As shown in FIG. 9( a ), an insulating pattern 51 is provided in a part of the insulating layer 7 where the wiring pattern 25 is not present by the ejection step and the curing step. Since the thickness of the insulating pattern 51 is set to be the same as the thickness of the wirin...

Embodiment approach 3

[0142] Hereinafter, a method of manufacturing a wiring board using the method for forming a multilayer structure of the present embodiment will be described.

[0143] First, prepare a setup such as Figure 10 The substrate 10A of the wiring pattern 25P shown in (a) and (b). Here, the wiring pattern 25P has a structure in which gold (Au) is plated on the surface of the copper wiring. Of course, the entire wiring pattern 25P may be formed of gold (Au). In the present embodiment, such a wiring pattern 25P is located on the surface of the substrate 10A. In this way, the surface of the substrate 10A is an example of the "object surface" of the present invention. Hereinafter, the substrate 10A and one or more layers on the substrate 10A are collectively referred to as "base body 10B".

[0144] like Figure 10 As shown in (b), the wiring pattern 25P includes the wiring 25PA, the wiring 25PB, and the wiring 25PC. The wiring 25PA, the wirings 25PB, and 25PC all have a strip shape...

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Abstract

The invention provides a multilayer construction with through holes by means of a liquid-drop ejection device. The forming method of the multilayer construction comprises the following steps: ejecting electrical conductivity material liquid-drop to form an electrical conductivity material figure on the surface of an object; burning to form the electrical conductivity material figure to form a wiring figure; ejecting the first insulation material liquid-drop containing photo-solidification material to form the first insulation material liquid-drop figure which rims the through holes on the wiring figure; solidifying the first insulation material figure to form the first insulation figure which rims the through holes; the steps of lyophilic operation on the surface of the object; ejecting the second insulation material liquid-drop containing the photo-solidification material to form a second insulation material figure which surrounds the first insulation figure and covers the wiring figure and the surface of lyophilic object ; solidifying the second insulation material figure to form the second insulation figure which surrounds the first insulation figure.

Description

Technical field [0001] The present invention relates to a multilayer structure forming method using a liquid droplet ejection device, and particularly to a multilayer structure forming method that is optimal for manufacturing wiring boards and electronic equipment. Background technique [0002] A method of manufacturing wiring boards and circuit boards using an additive process using a printing method has attracted widespread attention. This is because the cost of the additive method is low compared with the method of manufacturing wiring boards and circuit boards (repeating thin film coating methods and photolithography methods). [0003] As one of the technologies used in this additive method, a technology of forming a conductive pattern using an inkjet method is known (for example, Patent Document 1). [0004] (Patent document 1) Japanese Patent Application Publication No. 2004-6578 [0005] When forming a wiring pattern by the inkjet method, a conductive material patte...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/12H05K3/38H05K1/03B41J2/01B05D5/12H01L21/288H01B5/14H01B13/00
Inventor 新馆刚樱田和昭山田纯
Owner SEIKO EPSON CORP
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