Electronic device supplier

A technology for electronic devices and supply devices, applied in the direction of electrical components, electrical components, etc., can solve the problems of difficulty in recycling containers, insufficient recovery of sealing tape, difficulty in conveying sealing tape, etc., to achieve miniaturization, stability and good sealing tape. The effect of processing and securing the reclaimed space

Inactive Publication Date: 2009-07-01
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, it is necessary to downsize the electronic component supply device in the vertical direction in order to stably install the electronic component delivery position at an appropriate position, and it is difficult to make the recovery container large enough
As a result, the tape cannot be recovered sufficiently, and it is difficult to transport the tape stably.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0069] according to Figure 1 to Figure 8 Embodiments of the present invention will be described. The electronic component supply apparatus 10 as this embodiment is mounted on an electronic component mounting apparatus 100 that mounts various electronic components on various positions on a substrate, and supplies each electronic component.

[0070] figure 1 It is a perspective view of the electronic device mounting apparatus 100 . Such an electronic device mounting apparatus 100 includes a feeder table 101 for holding a plurality of electronic device feeders 10 in parallel, and a mounting operation unit 102 for mounting a substrate on which the electronic device M is mounted. a head 103 as a device holding mechanism, which holds a freely detachable suction nozzle and holds an electronic device M; an X-Y gantry 104 as a head moving mechanism, which drives the head 103 and conveys it to a predetermined anywhere within the range.

[0071] In the following description, one dir...

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PUM

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Abstract

An electronic device supply device (10) capable of consistently handling a cover tape of an electronic device carrier tape satisfactorily, the electronic device supply device is mounted on an electronic device mounting device (100) and supplies electronic devices, comprising: a reel a holding part (13) holding a reel (R) wound with a carrier tape (T) holding electronic devices at uniform intervals along the length direction; a frame (20) having a conveying path (21), The transport path guides the carrier tape from the reel holding portion at least to the electronic component transfer position (S) with the electronic device mounting device; The cover tape is peeled from the carrier tape which is guided along the conveying path. Wherein, the tape conveying mechanism has: a conveying roller (41) whose outer circumference is made of elastic body (41a) at least; a winding guide member (42) to make the tape wind up at least a part of the outer circumference of the conveying roller.

Description

technical field [0001] The present invention relates to an electronic component supply device that is mounted on an electronic component mounting device and supplies electronic components. Background technique [0002] The electronic device mounting device has: a head that absorbs the electronic device; an X-Y mechanism that transports the head to a substrate on which the electronic device is mounted; An electronic component supply device for electronic components. The electronic component loading device transports the head to the electronic component transfer position of each electronic component supply device, makes the head absorb the electronic component, and then transports the head to the loading target position of the substrate to mount the electronic component. [0003] The electronic component supply device mounted on the above-mentioned electronic component mounting device is generally in the shape of a long flat plate, and its front end is mounted on the mounting...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/02
Inventor 笹本宪一绪方秀一郎
Owner JUKI CORP
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