Electronic device supplier

A technology for electronic devices and supply devices, applied in the direction of electrical components, electrical components, etc., can solve the problems of insufficient recovery of the sealing tape, difficulty in recycling the container, difficulty in conveying the sealing tape, etc. Optimizing and ensuring the effect of reclaimed space

Inactive Publication Date: 2005-11-02
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, it is necessary to downsize the electronic component supply device in the vertical direction in order to stably install the electronic component delivery position at an app

Method used

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Examples

Experimental program
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Embodiment Construction

[0069] according to Figure 1 to Figure 8 Embodiments of the present invention will be described. The electronic component supply apparatus 10 according to this embodiment is mounted on an electronic component mounting apparatus 100 which mounts various electronic components on respective positions of a substrate, and supplies individual electronic components.

[0070] figure 1 is a perspective view of the electronic device mounting device 100 . Such an electronic device mounting apparatus 100 has: a feeder table 101 that holds a plurality of electronic device feeders 10 in parallel; ; as the head 103 of the device holding mechanism, it is holding a freely removable adsorption nozzle and holding the electronic device M; as the X-Y carriage (gantry) 104 of the head moving mechanism, it drives the head 103 and transports it to a specified position; anywhere within the range.

[0071] In addition, in the following description, one direction perpendicular to each other along t...

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PUM

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Abstract

An electronic component feeding apparatus 10 is loaded on an electronic component loading device 100 for feeding an electronic component. The electronic component feeding apparatus comprises a reel holder 13 for holding a reel R around which a carrier tape T is wound for holding the electronic component at a uniform interval in the lengthwise direction, a frame 20 including a carrier path 21 for guiding the carrier tape from the reel holder to at least an electronic component delivery position S to the electronic component loading device, and a cover sending mechanism 40 for feeding a cover tape C which is separated from the carrier tape guided on the carrier path to a predetermined discarding direction. The cover sending mechanism comprises a feeding roller 41 of which the outer periphery is comprised of an elastic body 41a, and a winding guide 42 for winding the cover tape around at least a portion of the outer periphery of the feeding roller.

Description

technical field [0001] The present invention relates to an electronic component supply device that is mounted on an electronic component mounting device and supplies electronic components. Background technique [0002] The electronic device mounting device has: a head that absorbs the electronic device; an X-Y mechanism that transports the head to a substrate on which the electronic device is mounted; An electronic component supply device for electronic components. The electronic component loading device transports the head to the electronic component transfer position of each electronic component supply device, makes the head absorb the electronic component, and then transports the head to the loading target position of the substrate to mount the electronic component. [0003] The electronic component supply device mounted on the above-mentioned electronic component mounting device is generally in the shape of a long flat plate, and its front end is mounted on the mounting...

Claims

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Application Information

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IPC IPC(8): H05K13/02
Inventor 笹本宪一绪方秀一郎
Owner JUKI CORP
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