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Electronic components mounting device

A technology for electronic component installation and electronic components, applied in the direction of electrical components, electrical components, etc., can solve problems such as insufficient efficiency of installation operations, and achieve the effect of further increasing efficiency and saving space

Active Publication Date: 2009-07-01
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, in the above-mentioned operation control, if the mounting time of one head unit is longer than the receiving time of the electronic component of the other head unit, the other head unit will have a waiting time, and there is a problem that the efficiency of the mounting work is insufficient.

Method used

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Embodiment Construction

[0036] --Overall structure of the embodiment--

[0037] Below, according to Figure 1 to Figure 5 The electronic component mounting apparatus 10 according to the embodiment of the present invention will be described. figure 1 is a perspective view of the electronic component mounting apparatus 10, figure 2 Indicates a top view.

[0038] In addition, the electronic component mounting apparatus 10 is an apparatus that transports the board K in the transport direction, fixes it at a predetermined position on the board transport path, and mounts electronic components on the board K.

[0039] In the following description, the conveying direction of the substrate K is defined as the X-axis direction, and the direction approximately perpendicular to the conveying direction of the substrate K is defined as the Y-axis direction (see Figure 1 to Figure 5 ).

[0040] Electronic component mounting device 10 such as figure 1 with figure 2 As shown, it has: a rectangular frame-shap...

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PUM

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Abstract

The present invention provides an electronic component mounting device that improves the work efficiency of mounting on a substrate. Substrate holding units (31, 32) are provided in the middle of the conveying path of the conveying units (21, 22) of the substrate (K), and there are guide frames (51, 52) for the head unit set across the conveying path. The first positioning mechanism for positioning the head unit of the guide frame and the second positioning mechanism for positioning the head unit in the conveying direction. The unit and the head unit supported by the other guide frame only perform mounting operations on substrates held on different substrate holding units.

Description

technical field [0001] The present invention relates to an electronic component mounting device for positioning and mounting electronic components at predetermined positions with respect to a substrate. Background technique [0002] [Patent Document 1] JP-A-2003-243894 [0003] In the conventional electronic component mounting apparatus, there are: a substrate conveying unit that conveys the substrate in a predetermined direction; a substrate holding unit that is installed in the middle of the substrate conveying path; Orientation settings. In addition, it also has: a head unit for sucking the substrate conveyed along each guide frame; a guide moving mechanism for moving the guide frame along the substrate conveying direction; An electronic component supply unit of an electronic component (for example, refer to Patent Document 1). [0004] Moreover, each of the above-mentioned electronic component supply units is composed of a plurality of electronic component feeding dev...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04H05K13/08
Inventor 黑田洁
Owner JUKI CORP
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