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Encapsulating material and method for making same

A packaging material and filler technology, applied in chemical instruments and methods, other chemical processes, etc., can solve the problems of low initial viscosity, easy cracking, large initial viscosity, etc., and achieve the effect of improving wettability and good dispersion.

Inactive Publication Date: 2009-08-26
JIANGSU ASIAN STAR ANCHOR CHAIN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the shortcomings of the existing packaging materials with high initial viscosity and easy cracking, and provide a packaging material with low initial viscosity and difficult cracking and its preparation method

Method used

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  • Encapsulating material and method for making same

Examples

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Effect test

preparation example Construction

[0017] The preparation method of the encapsulation material provided by the invention comprises the steps of dissolving a coupling agent into a solvent, adding a filler, removing the solvent after uniform dispersion, and then uniformly mixing the obtained product with an epoxy resin and a curing agent. According to the preparation method of the packaging material provided by the present invention, the dispersion time is 10-100 minutes. The solvent may be any solvent that can dissolve the coupling agent but does not react with the filler or the coupling agent and is easily removed, such as alcohols and ketones. Preference is given to acetone, methanol, butanone, ethanol or mixtures thereof. The amount of the solvent is only required to disperse the coupling agent and the filler uniformly, for example, the weight of the solvent is 10-100 times that of the coupling agent. Any method in the prior art can be used to remove the solvent, such as vacuum drying, natural drying, blast ...

Embodiment 1

[0024] This example is used to illustrate the encapsulation material and its preparation method of the present invention.

[0025] Dissolve 12 parts by weight of γ-(methacryloyloxy)propyltrimethoxysilane in 300 parts by weight of acetone, add 100 parts by weight of silicon powder with an average particle diameter of 15 microns, disperse for 80 minutes, and let stand Vacuum drying (vacuum degree is 0.06 MPa) after 30 hours.

[0026] 108 parts by weight of the above-mentioned silicon powder, 16 parts by weight of cyanoguanidine, 15 parts by weight of dibutyl phthalate, 8 parts by weight of 2,4,6-(N,N-dimethylaminomethyl ) phenol was added to 100 parts of bisphenol A epoxy resin (epoxy equivalent 184, number average molecular weight 500), mixed evenly, vacuum defoaming (vacuum degree is 0.06 MPa) to obtain packaging material A1.

Embodiment 2

[0028] This example is used to illustrate the encapsulation material and its preparation method of the present invention.

[0029] Dissolve 2 parts by weight of γ-aminopropyltriethoxysilane in 200 parts by weight of acetone, add 60 parts by weight of silicon powder with an average particle size of 75 microns, disperse for 40 minutes, leave it to stand for 18 hours, and then vacuum dry Dry (vacuum degree is 0.05 MPa).

[0030]62 parts by weight of silica powder, 8 parts by weight of cyanoguanidine, and 5 parts by weight of tributyl phosphate are added to 100 parts of bisphenol A epoxy resin (epoxy equivalent 240, number average molecular weight is 750) through the above-mentioned treatment of 62 parts by weight, mixing Uniform, vacuum defoaming (vacuum degree is 0.05 MPa) to obtain packaging material A2.

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Abstract

The invention discloses a packing material, which comprises the following parts: 100wt% epoxy resin, 30-150% filler, 1-30wt% solidifier and 0.01-20wt% coupler, wherein the coupler is silane coupler.

Description

technical field [0001] The present invention relates to packaging materials and preparation methods thereof, more particularly to electronic component packaging materials and preparation methods thereof. Background technique [0002] Packaging is a protective measure that uses specific packaging materials to solidify and isolate the components of electronic products that have been arranged and connected from the environment. It can prevent the intrusion of moisture, dust and harmful gas to electronic components, slow down vibration, prevent external damage and stabilize component parameters. Therefore, in addition to good insulation, chemical resistance and low moisture absorption, the packaging material should also have good high temperature and low temperature (-40-120°C) performance and impact resistance. [0003] Existing encapsulation materials mainly contain epoxy resin, filler and curing agent. Due to the diversity of materials of electronic products, there is a dif...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K3/10C08L63/00
Inventor 张玉梅
Owner JIANGSU ASIAN STAR ANCHOR CHAIN