High-permeability water-borne epoxy slurry as well as preparation method and application thereof

A water-based epoxy, high-penetration technology, used in epoxy resin adhesives, adhesive types, adhesives, etc.

Active Publication Date: 2018-04-03
国科广化(南雄)新材料研究院有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Through phenolic modification, the hydrophobicity of polyamine can be enhanced, the whitening and falling off of the water interface can be reduced, and the strength of the cured product can be improved, but the permeability, uniformity, phase separation, curing shrinkage, etc. There are still many deficiencies and deficiencies
The amphiphilic, reversible reaction with water amide Schiff base is one of the components of the high-permeability epoxy curing agent, and it is combined with the phenolic modified polyamine as the high-permeability epoxy resin slurry curing agent. There is no report in the literature

Method used

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  • High-permeability water-borne epoxy slurry as well as preparation method and application thereof
  • High-permeability water-borne epoxy slurry as well as preparation method and application thereof
  • High-permeability water-borne epoxy slurry as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] Embodiment 1: Preparation of water-based amide Schiff base complex curing agent

[0069] (1) Add 1039.5g (5.5 moles) of tetraethylenepentamine into a 5000mL three-necked flask, heat up to 50°C, and slowly add 1490g (5 moles) of ricinoleic acid (molecular weight: 298, Zibo Wanmeng Chemical Co., Ltd. Co., Ltd.), and then heated up to 140°C to 150°C for 3 hours to react, during which 88.7g of water (theoretical water output was 90g) was distilled out under no solvent, at this time, ricinoleic acid amide-amine PAM1 was obtained. Then continue to heat up to 210 ° C for 5 hours, and in this process, 80.3 g of low boiling point liquid is evaporated under no solvent (through chromatographic analysis, the water is 76.9 g, and the others are polyamines), and after cooling, the product containing amide and Schiff Aqueous amide Schiff base complex WASB1 of the base. Samples were taken, and the measured viscosities of PAM1 and WASB1 at room temperature 25°C were 380 and 90 mPa·s, r...

Embodiment 2

[0074] Embodiment 2: the preparation of phenalkamine

[0075] (1) Phenolic tertiary amine DMP-30 derivative FQSA1: Add 265.4g (1 mole) of 2,4,6-tri-N,N-dimethylaminomethylphenol DMP-30 into a 1000mL three-neck flask, add 129g (1 mole) of di-n-butylamine, heated to 120°C for reflux reaction for 3 hours, then distilled, and the distillate was recovered at low temperature to obtain 48.5g of distillate, which contained 44.1g of dimethylamine by chromatographic analysis . The distillation residue is the phenalk tertiary amine FQSA1 which has partially exchanged dimethylamino with dibutylamino.

[0076] (2) Phenol-formaldehyde long-carbon secondary amine condensate FQSA2: Add 181g (1 mole) of dicyclohexylamine to a 500mL three-necked flask, heat up to 80°C, and gradually add paraformaldehyde solid powder while maintaining a temperature of 80-100°C A total of 30g was stirred and dissolved gradually; after dissolution, 94g of phenol was added, and the temperature was raised to 140-1...

Embodiment 3

[0083] Embodiment 3: the water emulsification dispersibility of solidifying agent

[0084] The water-based amide Schiff base complex curing agent prepared in Example 1 above was mixed with water at a mass ratio of 5:1 and 1:1 to carry out emulsification and dispersion performance experiments, and the results are shown in Table 1 below.

[0085] The water emulsification dispersion performance data of the aqueous amide Schiff base complex solidifying agent prepared in the embodiment 1 of table 1

[0086]

[0087] The aqueous amide Schiff base composite curing agent prepared in Example 1 and the phenalkamine prepared in Example 2 are compounded in a mass ratio of 1:1 to form a composite curing agent, and then the mass ratio of the composite curing agent to water is 5: 1 and 1:1 were mixed and stirred to carry out emulsification and dispersion performance experiments, and the results are shown in Table 2 below.

[0088] Table 2 Water emulsification performance data of water-ba...

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Abstract

The invention belongs to the field of adhesives and discloses high-permeability water-borne epoxy slurry as well as a preparation method and an application thereof. The slurry is prepared from a component A and a component B, wherein the component A comprises 15wt%-40wt% of liquid epoxy resin, 60wt%-85wt% of an activated diluent and 0-1wt% of a silane coupling agent; the component B comprises 40wt%-80wt% of a waterborne amide Schiff base compound curing agent and 20wt%-60wt% of a phenolic amine compound. During use, the component A and the component B are uniformly mixed in the mass ratio being 100:(10-30), and the high-permeability water-borne epoxy slurry is obtained. The slurry has excellent mechanical property on a wet or dry basal plane and has broad application prospects in the engineering fields of hole sealing treatment of porous materials such as porous ceramic or porous resin molds and the like, interfacial adhesion treatment agents, chemical grouting for waterproof and leakage-proof reinforcement or the like.

Description

technical field [0001] The invention belongs to the field of adhesives, in particular to a high-permeability water-based epoxy slurry and its preparation method and application. Background technique [0002] The high-permeability epoxy slurry uses epoxy resin, diluent and polyamine curing agent as the main raw materials, and has a low initial viscosity. It has been widely used in construction, dam, subway waterproof plugging, reinforcement and repair projects and other fields. However, most of these slurries use water-soluble aliphatic or alicyclic polyamine curing agents, and the epoxy slurries containing these polyamines diffuse to the water phase when they contact the surface or interior of the substrate and contact with water. It dissolves in the water phase and loses the curing reaction activity, causing whitening on the water-containing interface, and even causing partial or even larger area or overall curing failure, interface shedding, phase separation shrinkage or a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08G59/56C08G59/54C09J163/00
CPCC08G59/54C08G59/56C08G59/62C09J163/00
Inventor 黄月文王斌郑周姜智聪鲁道欢
Owner 国科广化(南雄)新材料研究院有限公司
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