Initiative element array substrate
A technology of active components and array substrates, applied in the direction of electrical components, electric solid devices, semiconductor devices, etc., can solve the problems of electrostatic damage, large area, and easy accumulation of large static electricity, so as to reduce the possibility and reduce the possibility of electrostatic discharge sexual effect
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no. 1 example
[0034] figure 2 is a schematic diagram of an active device array substrate according to the first embodiment of the present invention. Please refer to figure 2 The active device array substrate 200 of this embodiment includes a substrate 210 , an active device array 220 , a plurality of bonding pad groups 230 , a plurality of connection lines 240 and a plurality of switching elements 250 . Wherein, the substrate 210 has a display area 210a and a peripheral circuit area 210b, and the active device array 220 is disposed on the display area 210a. The pad groups 230 are disposed on the peripheral circuit area 210b, and each pad group 230 is electrically connected to each other. In addition, each bonding pad group 230 includes a plurality of bonding pads 230 a and 230 b, and the bonding pad 230 a of each bonding pad group 230 is electrically connected to the active device array 220 . The connection lines 240 are disposed on the peripheral circuit area 210b, and the pad groups ...
no. 2 example
[0041] image 3 is a schematic diagram of an active device array substrate according to the second embodiment of the present invention. Please refer to image 3 , this embodiment is similar to the first embodiment, the difference is that: in this embodiment, the pads 230 b of each pad group 230 are electrically connected to the inner ESD protection ring 260 . Therefore, the static electricity conducted to the pad 230b of a certain pad group 230 can not only be transferred to another pad group 230 via the connecting wire 240, but also be transferred to the entire active device array substrate 200 via the internal static protection ring 260. . In addition, it should be noted that, in order to avoid signal interference during testing, the pad 230b connected to the inner ESD protection ring 260 cannot be electrically connected to the outer ESD protection ring 270 .
[0042] As in the first embodiment, the outermost pads 230b of each pad group 230 can be dummy pads or shared pad...
no. 3 example
[0044] Figure 4 is a schematic diagram of an active device array substrate according to a third embodiment of the present invention. Please refer to Figure 4 , this embodiment is similar to the first embodiment, the difference is that: when the pads 330b of each pad group 230 are common pads, the static electricity accumulated on the pads 230a can pass through the switching element 250 and the soldering pads in sequence. The pad 330b conducts to the entire active device array substrate 200 . In addition, although the welding pad 330 b in this embodiment is electrically connected to the external ESD protection ring 270 , in another embodiment, the welding pad 330 b may not be electrically connected to the external ESD protection ring 270 .
[0045] Furthermore, the welding pad 330b is not limited to be located on the outermost side of each welding pad group 230 , and the welding pad 330b can also be located at any position in each welding pad group 230 . In addition, the b...
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