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Substrate with electrostatic self-protection ability and manufacturing method thereof

A substrate and capability technology, applied to the substrate with electrostatic self-protection capability and its manufacturing field, can solve the problems of ESD and product failure in the panel area, reduce the possibility of electrostatic discharge, and improve the product yield.

Active Publication Date: 2015-08-12
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is the problem that ESD is prone to occur in the panel area and cause defective products

Method used

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  • Substrate with electrostatic self-protection ability and manufacturing method thereof
  • Substrate with electrostatic self-protection ability and manufacturing method thereof
  • Substrate with electrostatic self-protection ability and manufacturing method thereof

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Embodiment Construction

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] figure 1 A schematic diagram of a substrate with electrostatic self-protection capability according to an embodiment of the present invention is shown. Such as figure 1 As shown, the central part of the substrate 1 has a panel area 2, the opposite sides of the panel area 2 have the first gate metal layer 3 and the source / drain metal lay...

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Abstract

The invention discloses a substrate with electrostatic self-protection capability and a manufacturing method thereof. The substrate includes: a panel area; a first grid metal layer and a source / drain metal layer located outside at least one side of the panel area , the first gate metal layer and the source / drain metal layer are arranged in parallel and adjacent to each other in their length direction, and extend from the first gate metal layer to the source / drain metal layer At least one tip, and / or at least one tip extending from the source / drain metal layer to the first gate metal layer.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate with electrostatic self-protection capability and a manufacturing method thereof. Background technique [0002] With the continuous advancement of display technology, in order to reduce manufacturing costs and improve competitiveness, the generation lines of TFT-LCD manufacturing industry are gradually increasing, with higher requirements for process technology and control, and electrostatic protection has become one of the problems that high-generation lines need to face . Usually, in order to prevent the occurrence of electrostatic breakdown during the manufacturing process, designs such as short circuits are added to the panel design, but these designs are usually only aimed at electrostatic protection during the manufacturing process after the circuit is formed. At present, the size of the glass substrate of the high-generation line continues to increase, and at...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L21/77
CPCG02F1/136204H01L2924/0002H01L27/0288H01L27/124H01L29/401H01L2924/00H01L23/60H01L29/41733H01L29/41775H01L29/42356H01L29/42376H01L29/42384H01L29/66484H01L29/66742H01L29/78645
Inventor 陈曦冯玉春袁剑峰
Owner BOE TECH GRP CO LTD